Low profile inductors for high density circuit boards

ABSTRACT

An inductor includes a core formed of a magnetic material and a foil winding wound at least partially around or through at least a portion of the core. A first end of the winding extends away from the core to form an extended output tongue configured and arranged to supplement or serve as a substitute for a printed circuit board foil trace. A second end of the winding forms a solder tab. At least a portion of the extended output tongue and the solder tab are formed at a same height relative to a bottom surface of the core. Another inductor includes a core formed of a magnetic material, a winding wound at least partially around or through at least a portion of the core, and a ground return conductor attached to the core. The core does not form a magnetic path loop around the ground return conductor.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.13/297,216 filed Nov. 15, 2011, which is a continuation-in-part of U.S.patent application Ser. No. 12/940,933 filed Nov. 5, 2010, now U.S. Pat.No. 8,299,882, which is a continuation-in-part of U.S. patentapplication Ser. No. 12/507,751 filed Jul. 22, 2009, now U.S. Pat. No.8,040,212. Each of the above-mentioned applications is incorporatedherein by reference.

FIELD

The present document relates to the field of low profile inductor designfor high-density printed circuit boards. In particular, the documentrelates to a low profile inductor suitable for use beneath processorheat sinks and in other areas where conventional inductors may interferewith other components.

BACKGROUND

Many high density printed circuit board assemblies (PCBs) are installedin tight housings, or have bulky components attached to them, such thatcomponent height in portions of the PCB must be limited. For example, inthe area near a processor of a personal computer motherboard, componentheight must be limited to avoid mechanical interference with processorheat sinks. Similarly, high profile components on PCMCIA or Cardbusdevices are undesirable because they may require the device to occupytwo slots in a laptop computer's connector instead of a single slot;occupancy of multiple slots may limit further system expandability andmay prevent use with machines having only a single slot available.

Voltage regulated down-converters for providing power to microprocessorintegrated circuits of laptop and desktop personal computers are known.Such converters typically include one or more inductors.

Inductors for switching power converters, such as voltage regulators,have been proposed. For example, commonly owned U.S. Pat. No. 7,352,269to Li et al. (“Li”), which is incorporated herein by reference,discloses, in part, various coupled inductors. FIG. 71 shows one priorart coupled inductor 7100, which is similar to that of Li's FIG. 4, andincludes windings 7102, 7104 wound through a passageway 7106 in amagnetic core 7108. Leakage inductance associated with windings 7102,7104 is roughly proportional to a separation distance 7110 betweenwindings 7102, 7104.

SUMMARY

In an embodiment, an inductor for assembly on a printed circuit boardincludes a core formed of a magnetic material and a first foil windingwound at least partially around or through at least a portion of thecore. A first end of the first winding extends away from the core toform a first extended output tongue, and a second end of the firstwinding forms a solder tab. The solder tab and at least a portion of thefirst extended output tongue are formed at a same height relative to abottom surface of the core for surface mount attachment to the printedcircuit board. The first extended output tongue is configured andarranged to supplement or serve as a substitute for a first foil tracedisposed on a surface of the printed circuit board.

In an embodiment, an inductor for assembly on a printed circuit boardincludes a core formed of a magnetic material, a first winding wound atleast partially around or through at least a portion of the core, and afirst ground return conductor attached to the core. The first windingand the first ground return conductor are configured and arranged suchthat inductance of the first ground return conductor is notsignificantly increased by presence of the core, while inductance of thefirst winding is significantly increased by presence of the core,relative to an otherwise identical inductor without the core.

In an embodiment, an inductor for assembly on a printed circuit boardincludes an elongated ground return conductor forming at least onesolder tab at each end of the conductor. The inductor further includesat least two spacer elements disposed on the ground return conductor andan elongated foil winding forming at least one solder tab at each end ofthe winding. The winding is disposed on the spacer elements such thatthe spacer elements separate the ground return conductor from thewinding to create a channel between the ground return conductor and thewinding.

In an embodiment, a printed circuit board assembly has a drop-ininductor attached to a printed circuit board. The drop-in inductorincludes a first foil winding wound through an opening in a magneticcore and a first ground return conductor attached to the core. The firstfoil winding and the first ground return conductor are configured andarranged such that inductance of the first ground return conductor isnot significantly increased by presence of the core, while inductance ofthe first foil winding is significantly increased by presence of thecore, relative to an otherwise identical inductor without the core. Thefirst foil winding and the first ground return conductor have endsformed as solder tabs for attachment to the printed circuit board, andthe tabs of the first foil winding and the first ground return conductorare formed at a same height relative to a bottom surface of the core.The tabs of the first foil winding and the tabs of the first groundreturn conductor are attached to foil of the same layer of the printedcircuit board. The printed circuit board forms an aperture, and the coreof the inductor extends into the aperture.

In an embodiment, a printed circuit board assembly includes a printedcircuit board, at least one switching device attached to the printedcircuit board, and an inductor attached to the printed circuit board.The inductor includes a core formed of a magnetic material and a foilwinding wound at least partially around or through at least a portion ofthe core. A first end of the winding extends away from the core to forman extended input tongue. At least a portion of the extended inputtongue is soldered to and supplements a first foil trace disposed on anouter surface of the printed circuit board, where the first foil traceelectrically couples the at least one switching device to the first endof the winding.

In an embodiment, a printed circuit board assembly includes a printedcircuit board, at least one switching device attached to the printedcircuit board, and an inductor attached to the printed circuit board.The inductor includes a core formed of a magnetic material and a foilwinding wound at least partially around or through at least a portion ofthe core. A first end of the winding is electrically coupled to the atleast one switching device, and a second end of the winding extends awayfrom the core to form an extended output tongue. At least a portion ofthe extended output tongue is soldered to and supplements a first foiltrace disposed on an outer surface of the printed circuit board.

In an embodiment, an inductor for assembly on a printed circuit boardincludes a core formed of a magnetic material and a winding. The corehas a first side and a second side opposite to the first side. A linearseparation distance between the first and second sides of the coredefines a length of the core. The winding includes (a) a core windingportion wound through the core, (b) a foil input tongue at the firstside of the core and extending away from the core in the lengthwisedirection, and (c) a foil output tongue at the second side of the coreand extending away from the core in the lengthwise direction. At least aportion of the foil input tongue and the foil output tongue are formedat a same height relative to a bottom surface of the core for surfacemount attachment to the printed circuit board, where the height isgenerally perpendicular to the lengthwise direction.

In an embodiment, a coupled inductor includes a core, first and secondwindings, a leakage plate, and a first ground return conductor. The coreis formed of magnetic material and has opposing top and bottom surfaces.The first winding is wound through the core and includes portionsalternately disposed on the bottom and top surfaces of the core, and thesecond winding is wound through the core and includes portionsalternately disposed on the bottom and top surfaces of the core in amanner opposite to that of the first winding. The leakage plate isformed of magnetic material and has opposing top and bottom surfaces.The leakage plate is disposed on the core such that the bottom surfaceof the leakage plate faces the top surface of the core. The first groundreturn conductor is disposed on either the bottom surface of the core orthe top surface of the leakage plate.

In an embodiment, a coupled inductor includes a magnetic core, first andsecond windings, and a ground return conductor. The magnetic coreincludes first and second magnetic elements, each having opposing topand bottom surfaces. The second magnetic element is disposed on thefirst magnetic element such that the bottom surface of the secondmagnetic element faces the top surface of the first magnetic element.The first and second windings are each disposed on the top surface ofthe first magnetic element. The ground return conductor is disposed oneither the bottom surface of the first magnetic element or the topsurface of the second magnetic element.

In an embodiment, a coupled inductor includes a core, a leakage plate, Nwindings, and a first ground return conductor. N is an integer greaterthan one. Each of the core and the leakage plate is formed of magneticmaterial and includes respective opposing top and bottom surfaces. Theleakage plate is disposed on the core such that the bottom surface ofthe leakage plate faces the top surface of the core. Each of the Nwindings is wound through the core and has opposing first and secondends respectively forming first and second solder tabs. Each first andsecond solder tab is disposed in a common plane between the bottomsurface of the core and the top surface of the leakage plate. The firstground return conductor is disposed on either the bottom surface of thecore or the top surface of the leakage plate, and the first groundreturn conductor forms at least two ground return solder tabs disposedin the common plane.

In an embodiment, a printed circuit assembly includes a printed circuitboard and a coupled inductor disposed in an aperture in the printedcircuit board. The coupled inductor includes a core, a leakage plate, Nwindings, and a first ground return conductor. N is an integer greaterthan one. Each of the core and the leakage plate is formed of magneticmaterial and includes respective opposing top and bottom surfaces. Theleakage plate is disposed on the core such that the bottom surface ofthe leakage plate faces the top surface of the core. Each of the Nwindings is wound through the core and has opposing first and secondends respectively forming first and second solder tabs. Each of thefirst and second solder tabs is disposed in a common plane between thebottom surface of the magnetic core and the top surface of the leakageplate, and each of the first and second solder tabs is soldered to arespective pad of the printed circuit board. The first ground returnconductor is disposed on either the bottom surface of the core or thetop surface of the leakage plate. The first ground return conductorforms at least two ground return solder tabs disposed in the commonplane and soldered to respective pads of the printed circuit board.

In an embodiment, a printed circuit assembly includes a printed circuitboard and a coupled inductor disposed in an aperture in the printedcircuit board. The coupled inductor includes first and second magneticelements, first and second windings, and a first ground returnconductor. Each of the first and second magnetic elements has respectiveopposing top and bottom surfaces. The second magnetic element isdisposed on the first magnetic element such that the bottom surface ofthe second magnetic element faces the top surface of the first magneticelement. The first and second winding are disposed on the top surface ofthe first magnetic element. Opposing first and second ends of the firstwinding form respective first and second solder tabs soldered to theprinted circuit board and disposed in a common plane between the bottomsurface of the first magnetic element and the top surface of the secondmagnetic element. Opposing first and second ends of the second windingform respective first and second solder tabs disposed in the commonplane and soldered to the printed circuit board. The first ground returnconductor is disposed on either the bottom surface of the first magneticelement or the top surface of the second magnetic element. The firstground return conductor forms at least two ground return solder tabsdisposed in the common plane and soldered to the printed circuit board.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a PRIOR ART cross section of a motherboard.

FIG. 2 is a schematic of a PRIOR ART motherboard.

FIG. 3 shows a side plan view of one inductor installed on a PCB,according to an embodiment.

FIG. 4 shows a top plan view of the inductor of FIG. 3.

FIG. 5 shows a side plan view of another embodiment of the inductor ofFIG. 3 installed on a PCB.

FIG. 6 shows a side plan view of yet another embodiment of the inductorof FIG. 3 installed on a PCB.

FIG. 7 shows a top plan view of the inductor of FIG. 6.

FIG. 8 shows a side plan view of one inductor including ground returnconductors installed on a PCB, according to an embodiment.

FIG. 9 shows a top plan view of the inductor of FIG. 8.

FIG. 10 shows a top perspective view of the inductor of FIGS. 8 and 9with a magnetic core removed.

FIG. 11 shows a top plan view of one PCB footprint for use with theinductor of FIGS. 8-10, according to an embodiment.

FIG. 12 is a side plan view of another embodiment of the inductor ofFIG. 8 installed on a PCB.

FIG. 13 is a top plan view of the inductor of FIG. 12.

FIG. 14 is a top perspective view of the inductor of FIGS. 12 and 13with a magnetic core removed.

FIG. 15 shows a side plan view of yet another embodiment of the inductorof FIG. 8 installed on a PCB.

FIG. 16 shows a top plan view of the inductor of FIG. 15.

FIG. 17 shows a top perspective view of inductor of FIGS. 15 and 16.

FIG. 18 shows a top plan view one coupled inductor including extendedoutput tongues, according to an embodiment.

FIG. 19 shows a top perspective view of one winding of the inductor ofFIG. 18.

FIG. 20 shows a top perspective view of another embodiment of theinductor of FIG. 18.

FIG. 21 shows a top plan view of one coupled inductor including groundreturn conductors and extended input and output tongues, according to anembodiment.

FIG. 22 shows a top plan view of an embodiment of the coupled inductorof FIG. 21 including an isolator.

FIG. 23 shows a side plan view of the inductor of FIG. 22.

FIG. 24 shows a top plan view of one coupled inductor including groundreturn conductors and extend output tongues, according to an embodiment.

FIG. 25 shows a side plan view of the coupled inductor of FIG. 24installed on a PCB.

FIG. 26 is a top perspective view of the coupled inductor of FIGS. 24and 25.

FIG. 27 shows a top plan view of one coupled inductor including groundreturn conductors and extended output tongues, according to anembodiment.

FIG. 28 shows a side plan view of the coupled inductor of FIG. 27installed on a PCB.

FIG. 29 shows a side plan view of one inductor having a low profileinstalled on a PCB, according to an embodiment.

FIG. 30 shows a top plan view of the inductor of FIG. 29.

FIG. 31 shows a top perspective view of the inductor of FIGS. 29 and 30with isolators removed.

FIG. 32 shows one PCB footprint for use with the inductor of FIGS.29-31, according to an embodiment.

FIG. 33 shows a side plan view of one inductor having a low profileinstalled on a PCB, according to an embodiment.

FIG. 34 shows a top plan view of the inductor of FIG. 33.

FIG. 35 shows a top perspective view of the inductor of FIGS. 33 and 34with magnetic sections removed.

FIG. 36 shows a side plan view of one inductor having a low profileinstalled on a PCB, according to an embodiment.

FIG. 37 shows a top plan view of the inductor of FIG. 36.

FIG. 38 shows a top perspective view of the inductor of FIGS. 36 and 37with magnetic sections removed.

FIG. 39 shows a side cross-sectional view of a PRIOR ART drop-ininductor installed in a PCB aperture.

FIG. 40 shows a top plan view of the inductor of FIG. 39 installed in aPCB aperture.

FIG. 41 shows a top plan view of a plurality of PRIOR ART drop-ininductors installed in respective PCB apertures.

FIG. 42 shows a side cross-sectional view of one drop-in inductorincluding ground return conductors installed in a PCB aperture,according to an embodiment.

FIG. 43 shows a top plan view of the inductor of FIG. 42 installed in aPCB aperture.

FIG. 44 shows a top perspective view of the inductor of FIGS. 42 and 43.

FIG. 45 shows a top perspective view of the inductor of FIGS. 42-44 witha magnetic core removed.

FIG. 46 shows a top perspective view of one drop-in inductor includingground return conductors, according to an embodiment.

FIG. 47 shows an exploded perspective view of the inductor of FIG. 46with a magnetic core removed.

FIG. 48 shows a top perspective view of another embodiment of theinductor of FIGS. 46-47.

FIG. 49 shows an exploded perspective view of the inductor of FIG. 48with a magnetic core removed.

FIG. 50 shows a top perspective view of one drop-in coupled inductorincluding ground return conductors, according to an embodiment.

FIG. 51 shows a top perspective view of the inductor of FIG. 50 with amagnetic core removed.

FIG. 52 shows a top plan view of one PCB assembly including anembodiment of the inductor of FIGS. 50-51.

FIG. 53 shows a top perspective view of one N-winding coupled inductorincluding a ground return structure, according to an embodiment.

FIG. 54 shows a top perspective view of the windings of the inductor ofFIG. 53.

FIG. 55 shows a top perspective view of the ground return structure ofthe inductor of FIG. 53.

FIG. 56 shows an embodiment of the inductor of FIG. 53 installed in aPCB.

FIG. 57 shows an alternate embodiment of the inductor of FIG. 53.

FIG. 58 shows a top perspective view of one N-winding coupled inductorincluding a ground return structure, according to an embodiment.

FIG. 59 shows a top perspective view of one winding of the inductor ofFIG. 58.

FIG. 60 shows an embodiment of the inductor of FIG. 58 installed in aPCB.

FIG. 61 shows an alternate embodiment of the inductor of FIG. 58.

FIGS. 62-64 respectively show a perspective, a side plan, and a top planview of an inductor including two extended tongues, according to anembodiment.

FIGS. 65-67 respectively show a perspective, a side plan, and a top planview of an embodiment of the inductor of FIGS. 62-64 including groundreturn conductors.

FIG. 68 shows a perspective view of an inductor similar to the inductorFIGS. 65-67, according to an embodiment.

FIG. 69 shows a perspective view of an inductor similar to the inductorof FIGS. 62-64, according to an embodiment.

FIG. 70 shows a perspective view of another inductor similar to theinductor of FIGS. 65-67, according to an embodiment.

FIG. 71 shows a perspective view of a PRIOR ART coupled inductor.

FIG. 72 shows a perspective view of a drop-in coupled inductor,according to an embodiment.

FIG. 73 shows the inductor of FIG. 72 with its leakage plate separatedfrom the remainder of the inductor.

FIG. 74 shows the core of the FIG. 72 inductor as transparent.

FIG. 75 shows an exploded perspective view of the FIG. 72 inductor, withits leakage plate and ground return conductors separated from theremainder of the inductor.

FIG. 76 shows a perspective view of the windings of the FIG. 72inductor.

FIG. 77 shows a cross-sectional view of a printed circuit assemblyincluding the inductor of FIG. 72, according to an embodiment.

FIG. 78 shows one possible PCB footprint for use with the inductor ofFIG. 72, according to an embodiment.

FIG. 79 shows a perspective view of an alternative ground returnconductor, according to an embodiment.

FIG. 80 shows a perspective view of the FIG. 72 inductor's core with thealternative ground return conductor of FIG. 79, according to anembodiment.

FIG. 81 shows a perspective view of a drop-in coupled inductor with analternative ground return conductor, according to an embodiment.

FIG. 82 shows a perspective view of the leakage plate and the groundreturn conductor of the FIG. 81 inductor.

FIG. 83 shows a top plan view of a magnetic core, according to anembodiment.

FIG. 84 shows a perspective view of a drop-in coupled inductor similarto that of FIG. 81 but with an alternative leakage plate, according toan embodiment.

FIG. 85 shows the FIG. 84 inductor with its leakage plate separated fromits core.

FIG. 86 shows a perspective view of another drop-in coupled inductor,according to an embodiment.

FIG. 87 shows the inductor of FIG. 86 with the leakage plate separatedfrom the core.

FIG. 88 shows the core of the FIG. 86 inductor as transparent.

FIG. 89 shows a perspective view of the ground return conductor of theFIG. 86 inductor.

FIG. 90 shows a cross-sectional view of a printed circuit assemblyincluding the inductor of FIG. 86, according to an embodiment.

FIG. 91 shows one possible PCB footprint for use with the FIG. 86inductor, according to an embodiment.

FIG. 92 shows a perspective view of a coupled inductor similar to thatof FIG. 86 but with an alternative leakage plate and ground returnconductor, according to an embodiment.

FIGS. 93 and 94 each show the FIG. 92 inductor with its leakage plateseparated from its core.

FIG. 95 shows a perspective view of another drop-in coupled inductor,according to an embodiment.

FIG. 96 shows a perspective view of the FIG. 95 inductor with itsmagnetic elements separated from each other.

FIG. 97 shows a perspective view of the FIG. 95 inductor with itsmagnetic elements shown as transparent.

FIG. 98 shows a perspective view of the FIG. 95 inductor with itsmagnetic elements separated from each other and shown as transparent.

FIG. 99 shows a perspective view of the windings of the FIG. 95 inductorseparated from each other.

FIG. 100 shows a cross-sectional view of a printed circuit assemblyincluding the FIG. 95 inductor, according to an embodiment.

FIG. 101 shows one possible PCB footprint for use with the FIG. 95inductor, according to an embodiment.

FIG. 102 shows a top plan view and FIG. 103 shows a side plan view of analternative embodiment of a magnetic element of the FIG. 95 inductor,according to an embodiment.

FIG. 104 shows a perspective view of a magnetic element of the FIG. 95inductor including an alternative ground return conductor, according toan embodiment.

FIG. 105 shows one possible PCB footprint for use with the FIG. 95inductor including the FIG. 104 alternative ground return conductor,according to an embodiment.

FIG. 106 shows a perspective view of another drop-in coupled inductor,according to an embodiment.

FIG. 107 shows the FIG. 106 inductor with its magnetic elementsseparated from each other.

FIG. 108 shows a top plan view of a magnetic element of the FIG. 106inductor, according to an embodiment.

FIG. 109 shows one possible PCB footprint for use with the FIG. 106inductor, according to an embodiment.

FIG. 110 shows a perspective view of another drop-in coupled inductor,according to an embodiment.

FIGS. 111 and 112 each show the coupled inductor of FIG. 110 with itsmagnetic elements separated from each other.

FIG. 113 shows a perspective view of another drop-in coupled inductorsimilar to that of FIG. 110 but with a different ground return conductorconfiguration, according to an embodiment.

FIGS. 114 and 115 each show the coupled inductor of FIG. 113 with itsmagnetic elements separated from each other.

FIG. 116 shows a perspective view of another drop-in coupled inductorsimilar to that of FIG. 113 but with a second magnetic element that doesnot overlap solder tabs of the coupled inductor, according to anembodiment.

FIGS. 117 and 118 each show the coupled inductor of FIG. 116 with itsmagnetic elements separated from each other.

FIG. 119 shows a perspective view of another drop-in coupled inductor,according to an embodiment.

FIGS. 120 and 121 each show the coupled inductor of FIG. 119 with itsmagnetic elements separated from each other.

DETAILED DESCRIPTION OF THE EMBODIMENTS

It is noted that, for purposes of illustrative clarity, certain elementsin the drawings may not be drawn to scale. Specific instances of an itemmay be referred to by use of a numeral in parentheses (e.g., winding1802(1)) while numerals without parentheses refer to any such item(e.g., windings 1802).

In a high density printed circuit board assembly, such as a processormotherboard 100 assembly (FIG. 1) as used in a personal computer, theremay be portions of the assembly where circuit height is restricted, yetdevices in or near these areas may require considerable power. Forexample, motherboard 100 assembly may have a multilayer printed circuitboard 102 with an attached processor 103 in a processor socket 104.Since processor 103 may dissipate considerable power—in some casesexceeding a hundred watts at peak computer performance—a heat sink andfan assembly 106 is attached to processor 103 to cool processor 103.Heat sink and fan assembly 106 is often a large, bulky, device requiringa considerable keep-out zone 120 beneath it where only low-profilecomponents are allowed on motherboard 100 to prevent components onmotherboard 100 from mechanically interfering with heat sink and fanassembly 106.

In some systems, heat sink and fan assembly 106 may actually occupy onlysome of the space shown; however a system manufacturer may have reserveda larger volume to allow air to flow into the heat sink, and to allowfor future use of a different heat sink or fan with future, faster, andeven more power-hungry, processors. In other systems and subsystems,such as PCMCIA or CARDBUS cards, height restrictions may derive fromother factors such as overall card or system dimensions. Further,component height is strictly limited in laptop systems because ofdesires to limit machine thickness.

Processor 103 draws considerable current since much of the power itconsumes is at a low “core” voltage, typically between one and twovolts, although voltage at the processor's “periphery” may be higher.The “core” voltage is typically provided by an on-board DC-to-DCdown-converter. The DC-to-DC converter has one or more inductors, suchas inductor 110, as well as several capacitors 112. Inductor 110 oftenhas height 114 that would interfere with heat sink and fan assembly 106if inductor 110 were located under heat sink and fan assembly 106.Inductor 106 is therefore located some distance away from processorsocket 104. Similar situations may also arise with high performancegraphics chips as these also consume considerable power and oftenrequire heat sinks.

A schematic diagram (FIG. 2) illustrates the resulting problem ofparasitic impedance. Down-converter 202 is, in this example, amultiphase buck converter having switching devices 204 that rapidlyalternate a connection to each of several phase inductors 206 between apowered, a grounded, and an unpowered state. Switching devices 204connect to respective phase inductors 206 via respective switching nodes(Vx) 216. Current builds in each phase inductor 206 when it is powered,and decays when it is grounded. Output voltage and current are afunction of the percentage of time that each phase inductor 206 ispowered. Phase inductors 206 may be magnetically coupled, as shown inFIG. 2.

Output terminals of the phase inductors 206 are coupled together and tocapacitors 208 and processor 210 via an output node (Vo) 218. If theconnection from phase inductors 206 to capacitor 208 and processor 210is made only via a typical thin foil PCB trace (e.g., trace 116 FIG. 1),significant unintended, parasitic, impedances 212 may exist betweenprocessor 210, capacitor 208, and converter inductors 206. Impedances212 may have an inductive and a resistive component.

The low processor voltage, typically between one and two volts, and highprocessor current, often reaching peak currents of fifty to one hundredamperes, make the system quite sensitive to what may seem quite lowparasitic impedances 212. For example, a current of one hundred amperesin a two-milliohm parasitic impedance is sufficient to provide a twohundred-millivolt drop; at a one volt core voltage, this may representtwenty percent of operating voltage. Such voltage drop due to thehundred amperes also relates to twenty watts of conduction loss and isenvironmentally undesirable, as this conduction loss represents powernot used in the circuit, but is power used to produce heat wasted in theboard layout.

It is desirable to minimize impedances 212, since these may not onlywaste power, but may allow processor 210 voltage to deviate outsidedesirable operating limits. The same arguments apply to parasiticimpedances 214 between inductors 206 and power semiconductors 204, it isdesirable to minimize these impedances also.

To minimize parasitic resistances in inductors 206, these inductors areoften wound with one or just a few turns of thick foil (i.e., aconductive material such as copper having at least a substantiallyrectangular cross-section) or wire around or inside a powdered iron,ferrite, or similar ferromagnetic core suitable for use at the highfrequencies—in the range 20 kHz to above 1 MHz—at which switchingdevices 204 typically operate. Multiple inductors 206 are often used,their outputs being connected in parallel and operated as a multiphaseconverter, to handle the requisite current. The foil with whichinductors 206 are wound is typically significantly thicker than foilused for traces 116 on the PCB. In the embodiment of FIG. 1, the foil ofthe inductor extends, typically downwards and often wrapping under thecore, to form a solder tab 122 that connects to foil of PCB traces 116.

FIG. 3 shows a side plan view of one inductor 300 installed on a PCB302, and FIG. 4 shows a top plan view of inductor 300. Inductor 300, forexample, is used to at least partially solve one or more of the problemsdiscussed above, and inductor 300 may be used in DC-to-DC converterapplications (e.g., as a buck converter output inductor). Inductor 300includes at least one electrically conductive winding 304 wound at leastpartially around or through at least a portion of a magnetic core 306.For example, winding 304 may be wound through an opening in core 306,such as shown in FIGS. 3 and 4, where dashed lines indicate the outlineof winding 304 where obscured core 306. Core 306 is, for example, formedof a ferrite and/or powdered iron material, and may consist of one ormultiple magnetic elements. In an embodiment, winding 304, for example,is a single turn “staple” foil winding, thereby helping to minimizewinding length and resistance.

Inductor 300 further includes an extended output tongue 308 extendingaway from core 306. Extended output tongue 308 has a thickness similarto that of winding 304, and extended output tongue 308 is electricallycoupled to one end of winding 304. Extended output tongue 308 is, forexample, an extension of winding 304—such configuration may helpsimplify construction of inductor 300 and/or reduce combined resistanceof winding 304 and extended output tongue 308. At least a portion ofextended output tongue 308 is configured for attaching (e.g., soldering)to a foil PCB trace or solder pad. Although extended output tongue 308is shown as having a width 402 which is the same as a width 404 of theportion of winding 304 that passes through or at least partially aroundcore 306, widths 402 and 404 may differ. For example, width 402 may begreater than width 404 to help minimize impedance of extended outputtongue 308. In motherboard applications, extended output tongue 308 istypically electrically coupled to an output node (e.g., a buck converteroutput node). However, inductor 300 is not limited to such uses. Forexample, extended output tongue 308 could couple to a power supplyintermediate node.

Inductor 300 further includes a solder tab 310 electrically coupled tothe other end of winding 304, for soldering to a foil PCB solder pad. Inmotherboard applications, solder tab 310 is typically coupled to aninput node (e.g., a switching node in a buck converter). In alternativeembodiments, solder tab 310 could alternately be replaced by a differenttype of connector, such as a through-hole pin.

At least a portion of extended output tongue 308 and solder tab 310 are,for example, formed at the same height relative to a bottom surface 316of core 306 to facilitate surface mount connection of inductor 300 to aPCB. Some of such embodiments are capable of being placed on a PCB usingpick-and-place equipment and soldered to traces or solder pads of thePCB using reflow soldering techniques (e.g., infrared reflow, hot gasconvection, vapor phase reflow) or wave soldering techniques.

In some embodiments, solder tab 310 is replaced with an extended inputtongue. For example, FIG. 5 shows a side plan view of one inductor 500installed on PCB 302. Inductor 500 is an embodiment of inductor 300where solder tab 310 has been replaced with an extended input tongue502. At least respective portions of extended output tongue 308 andextended input tongue 502 are, for example, formed at the same heightrelative to bottom surface 316 of core 306 to facilitate surface mountconnection of inductor 500 to a PCB. Extended input tongue 502 is, forexample, an extension of winding 304. Extended input tongue 502typically has mechanical characteristics (e.g., width, thickness)similar to that of extended output tongue 308. However, extended inputtongue 502 is shorter in most embodiments of inductor 500 than extendedoutput tongue 308 because switching devices are typically located nearcore 306 of inductor 500.

Extended output tongue 308 may be used to provide a low impedanceelectrical connection to inductor 300. For example, extended outputtongue 308 may be configured and arranged for supplementing a foil PCBtrace connected to inductor 300. In some embodiments, at least a portionof extended output tongue 308 is formed for soldering to and extendingalong a foil trace on a PCB outer surface, thereby serving as aconductor in parallel with the trace. Extended output tongue 308typically has a thickness that is much greater than that of the PCBtrace—accordingly, extended output tongue 308 typically has a much lowerelectrical and thermal impedance than the PCB trace. Extending extendedoutput tongue 308 along a PCB trace to supplement the trace maysignificantly lower the trace's effective impedance, thereby reducingvoltage drop and power loss in the trace, as well as improving thetrace's heat sink ability. As another example, extended output tongue308 may be used in place of a PCB trace to provide a low impedanceelectrical connection to one end of winding 304, and thereby free up aPCB layer for other uses, such as to route signal traces. Similarly,extended input tongue 502 (FIG. 5) may also supplement or be used inplace of a PCB trace to provide a low impedance electrical connection towinding 304.

Extended output tongue 308 may also serve as a heat sink, therebyhelping to cool inductor 300 and a PCB that tongue 308 is attached to.Extended output tongue 308 also typically has a low profile, which mayadvantageously allow use of rework equipment, pick and place equipment,and/or test probes in the vicinity of tongue 308. Furthermore, becauseextended output tongue 308 is part of inductor 300, extended outputtongue 308 may withstand pressure from hot air rework equipment withoutbeing blown off a PCB.

In typical embodiments, winding 304 and extended output tongue 308 areformed of copper foil, such as between three and five millimeters wide,and from two tenths to one half millimeter thick. It is desirable forwidth 402 of extended output tongue 308 to be at least 1 millimeter topromote low impedance of tongue 308. The foil winding material typicallyused for winding 304 and extended output tongue 308 is substantiallythicker than typical PCB copper foils (e.g., trace 116, FIG. 1) becausehalf-ounce copper foil, as is typically used in PCB layers requiringfine lines, is approximately eighteen thousandths of a millimeter thick.Even three ounce copper foil, which may be used on special-purpose powerand ground-plane layers, is only about a tenth of a millimeter thick.Since direct-current sheet-resistivity of a copper conductor isinversely proportional to its thickness, the sheet-resistivity ofextended output tongue 308 may be as little as one-fiftieth that of abare PCB trace of equivalent length and width. Extended output tongue308 typically has length 406 of at least one centimeter to bridge adistance between inductor 300 and another component or portion of a PCB.However, extended output tongue 308 could be significantly shorter(e.g., two millimeters) if it only needs to run a short distance.Inductors including shorter extended tongues are typically easier tomanufacture and assemble than inductors including longer extendedtongues.

FIG. 3 shows one possible use of inductor 300 in an application having aheight restriction 312 (e.g., due to a heat sink assembly). In theexample of FIG. 3, inductor 300 is connected between a DC-to-DCconverter (e.g., buck converter) switching node Vx (e.g., node 216, FIG.2), and a converter output node Vo (e.g., node 218, FIG. 2). A load 314(e.g., a processor) is powered from output node Vo. Extended outputtongue 308 provides a low impedance path between inductor 300 and load314, despite height restriction 312 dictating that inductor 300 beplaced remote from load 314. If inductor 308 did not include extendedoutput tongue 308, current from inductor 300 to load 314 would typicallyhave to flow through a much higher impedance trace of PCB 302. Inductor300, however, is not limited to use in buck converter or even inDC-to-DC converter applications. For example, some embodiments ofinductor 300 could be used in inverter applications.

FIGS. 6 and 7 show one possible application of an embodiment of inductor300. In particular, FIG. 6 shows a side plan view and FIG. 7 shows a topplan view of one inductor 600, which is an embodiment of inductor 300,installed on a PCB 602. In the examples of FIGS. 6 and 7, inductor 600serves as a buck converter output inductor. Extended input tongue 604connects one end of a winding 606 to a DC-to-DC converter switching nodeVx, while a solder tab 608 connects the other end of winding 606 to aDC-to-DC converter output node Vo. Winding 606 is wound at leastpartially around or through at least a portion of a magnetic core 610.Dashed lines indicate the outline of winding 606 where obscured by core610. Extended input tongue 604 spans a significant portion of a distance702 between inductor 600 and a switching device 612, therebysignificantly lowering the impedance between switching device 612 andinductor 600. Such lowering of impedance may significantly decreasepower loss, as switching node Vx typically conducts a large currentmagnitude.

As the extended tongues discussed above (e.g., extended output tongue308 of FIG. 3, extended input tongue 502 of FIG. 5) may significantlyimprove electrical and thermal conductivity from switching devices(e.g., power semiconductors) towards the load in DC-to-DC converterapplications, the concept of paralleling a thick foil with thin PCBtraces can also be applied to ground return currents (i.e., currentsfrom the load back to the DC-to-DC converter). An issue with applyingnaked foils to PCB traces is that such foils can be difficult to handle.

One or more ground return conductors can be attached to an inductor toimprove ground return conductivity in the inductor's vicinity. Theground return conductors, for example, are configured and arranged suchthat their inductance is not significantly increased by presence of theinductor's core, while inductance of the inductor's winding (orwindings) is significantly increased by presence of the inductor's core,relative to an otherwise identical inductor without the core. As anexample, the ground return conductors may be configured and arrangedsuch that the inductor's core does not form a magnetic path loop aroundthe ground return conductors. In such embodiments, the ground returnconductors are external to core, and the ground return conductors mayhave an inductance similar to that of a PCB ground plane extending undera standard surface mount inductor (without ground return conductors),where the ground plane is in close proximity to the standard surfacemount inductor's core.

In many applications, current flows from switching devices through theinductor and to a load. Return current typically flows from the load,through PCB conductive layers under the inductor, and back to theswitching devices. Accordingly, use of an inductor including groundreturn conductors may reduce ground return path impedance whilemaintaining the PCB's general current flow path.

Additionally, attaching a ground return conductor to an inductor allowsboth the inductor and the ground return conductor to be placed in asingle step, thereby eliminating multiple placement operations requiredfor placement of a discrete inductor and a discrete conductor.Furthermore, applying a foil conductor to a PCB may be difficult due tothe foil's flexibility, but attaching a foil ground return conductor toan inductor increases the conductor's rigidity and may therebyfacilitate the conductor's placement on a PCB.

For example, FIG. 8 shows a side plan view of one inductor 800 installedon a PCB 802, and FIG. 9 shows a top plan view of inductor 800. Inductor800 includes ground return conductors 804, 806, in addition to a winding808 wound at least partially around or through at least a portion of amagnetic core 810. Dashed lines indicate the outline of winding 808 andground return conductors 804, 806 where obscured by core 810 in FIGS. 8and 9. Core 810 does not form a magnetic path loop around ground returnconductors 804, 806. Accordingly, inductance of ground return conductors804, 806 is not significantly increased by the presence of core 810, andground return conductors 804, 806 have a lower inductance than winding808. FIG. 10 shows a top perspective view of inductor 800 with core 810removed, and FIG. 11 shows a top plan view of one possible PCB footprintfor use with inductor 800.

In some embodiments, each end of ground return conductors 804, 806 andeach end of winding 808 form respective solder tabs at a same heightrelative to a bottom surface 816 of core 810 to facilitate surface mountconnection of inductor 800 to a PCB. Ground return conductors 804, 806,for example, have a thickness similar to that of winding 808 and aresignificantly thicker than foil typically forming a PCB ground returnplane. Accordingly, ground return conductors 804, 806 may be used tosupplement (or replace) a ground return conductor in a PCB (e.g., a PCB802), and thereby significantly reduce the ground return impedance inthe vicinity of inductor 800. Since ground-return conductors 804, 806are attached to core 810, and thus to inductor 800, they are easier tohandle than discrete conductors and may be positioned by pick-and-placeequipment simultaneously with positioning inductor 800.

Accordingly, inductor 800 may be used to provide a low impedance,two-way path for current between DC-to-DC converter (e.g., buckconverter) switching devices and a load, as shown in the examples ofFIG. 8-11. In particular winding 808 may carry current from a switchingnode Vx to an output node Vo, as shown by arrows 812. Ground returnconductors 804, 806 may in turn carry at least part of the ground returncurrent from the load back to the switching devices, as shown by arrows814.

The configuration and quantity of ground return conductors 804, 806 maybe varied, and examples of some variations are discussed below.Additionally, although inductor 800 is discussed in the context ofwinding 808 carrying current to a load and ground return conductors 804,806 carrying ground return current, inductor 800 could be used in othermanners. For example, one or more of ground return conductors 804, 806could be utilized to carry current, such as current from a memory-keepalive power supply (not shown) to the load, instead of ground returncurrent. Furthermore, inductor 800 is not limited to use in DC-to-DCconverter applications. For example, some embodiments of inductor 800could be used in inverter applications.

A variation of inductor 800 is shown in FIGS. 12-14. FIG. 12 is a sideplan view of one inductor 1200 installed on a PCB 1202, and FIG. 13 is atop plan view of inductor 1200. Inductor 1200 is similar to inductor 300of FIG. 3; however, inductor 1200 includes ground return conductors1204, 1206 in addition to a winding 1208 at least partially wound aroundor through at least a portion of a magnetic core 1210. Dashed linesindicate the outline of winding 1208 and ground return conductors 1204,1206 where obscured by core 1210. Ground return conductors 1204, 1206attach to a bottom surface 1216 of core 1210, and core 1210 does notform a magnetic path loop around ground return conductors 1204, 1206.Accordingly, inductance of ground return conductors 1204, 1206 is notsignificantly increased by presence of core 1210. An extended outputtongue 1302 is electrically coupled to winding 1208, and ground returnconductors 1204, 1206, for example, extend at least partially along alength 1304 of extended output tongue 1302. FIG. 14 shows a topperspective view of inductor 1200 with core 1210 removed. Portions ofground conductors 1204, 1206 are, for example, formed at the same heightas extended output tongue 1302 with respect to bottom surface 1216 ofcore 1210 to facilitate surface mount connection of inductor 1200 to aPCB. FIG. 12 shows one possible application of inductor 1200 whereextended output tongue 1302 and ground return conductors 1204, 1206provide a two way, low impedance path between inductor 1200 and a load1212 despite a height restriction 1214 dictating that inductor 1200 beplaced remote from load 1212.

FIGS. 15-17 show another variation of inductor 800. In particular, FIG.15 shows a side plan view of one inductor 1500 installed on a PCB 1502.FIG. 16 shows a top plan view, and FIG. 17 shows a top perspective viewof inductor 1500. Inductor 1500 is similar to inductor 1200 (FIGS.12-14), but inductor 1500 includes an extended input tongue 1504electrically coupled to a winding 1506. Ground return conductors 1508,1510 extend at least partially along a length 1602 of an extended outputtongue 1604. Winding 1506 is wound at least partially around or throughat least a portion of a magnetic core 1514. Dashed lines indicate theoutline of winding 1506 and ground return conductors 1508, 1510 whereobscured by core 1514 in the plan views of FIGS. 15 and 16. Core 1514 isshown as being transparent in FIG. 17. Extended output tongue 1604,extended input tongue 1504, and the portions of ground return conductors1508, 1510 extending along extended output tongue 1604 are, for example,formed at the same height relative to a bottom surface 1520 of core 1514to facilitate surface mount connection of inductor 1500 to a PCB.Inductor 1500 is, for example, used to provide a two way, low impedancepath between DC-to-DC converter switching devices and inductor 1500, aswell as between inductor 1500 and a load 1516 separated from inductor1500 by a height restriction 1518.

Some embodiments of inductors with an extended tongue (e.g., inductor300, FIG. 3) and inductors with ground return conductors (e.g., inductor800, FIG. 8) are multiple winding inductors with N windings, where N isan integer greater than one. For example, FIG. 18 shows a top plan viewof one coupled inductor 1800, which includes three windings 1802 whichare magnetically coupled together by a magnetic core 1804. Dashed linesindicate the outline of windings 1802 where obscured by core 1804. Arespective extended output tongue 1806 is electrically coupled to oneend of each winding 1802, and a respective extended input tongue 1808 iselectrically coupled to the other end of each winding 1802. Eachextended output tongue 1806 and each extended input tongue 1808 is, forexample, an extension of a respective winding 1802. FIG. 19 shows a topperspective view of one winding 1802.

At least portions of extended output tongues 1806 and extended inputtongues 1808 are, for example, formed at a same height relative to abottom surface of core 1804 to facilitate surface mount connection ofinductor 1800 to a PCB. Each extended output tongue 1806, for example,supplements or replaces a PCB trace connecting inductor 1800 to a load(e.g., a processor). Each extended input tongue 1808, for example,supplements or replaces a PCB trace connecting inductor 1800 to DC-to-DCconverter switching devices. Although FIG. 18 shows inductor 1800 asincluding three windings, inductor 1800 could have any number ofwindings greater than one. For example, FIG. 20 shows a top perspectiveview of a four winding embodiment of inductor 1800.

In some systems, each winding of a multiple winding inductor (e.g.,inductor 1800) may be part of a separate phase of a multiphase DC-to-DCconverter, such as discussed above with respect to FIG. 2.

FIG. 21 shows a top plan view of one coupled inductor 2100, which issimilar to inductor 1800 (FIG. 18); however, inductor 2100 includesground return conductors 2102 disposed along extended output tongues2104, where each extended output tongue 2104 is electrically coupled toa respective winding 2106. Ground return conductors 2102, for example,provide a low impedance ground return path between inductor 2100 andanother component (e.g., a load, such as a processor). Ground returnconductors 2102 as well as extended output tongues 2104 also may serveas heat sinks to cool a PCB that inductor 2100 is installed on. Dashedlines in FIG. 21 indicate outlines of windings 2106 and ground returnconductors 2102 where obscured by a magnetic core 2108 of inductor 2100.At least respective portions of ground return conductors 2102, extendedoutput tongues 2104, and extended input tongues 2110 are, for example,formed at a same height relative to a bottom surface of inductor 2100 tofacilitate surface mount connection to a PCB.

It should be noted that the quantity of windings as well as the quantityand configuration of ground return conductors may be varied. Forexample, FIG. 22 is a top plan view and FIG. 23 is a side plan view ofone coupled inductor 2200, which is an embodiment of coupled inductor2100 including at least one mechanical isolator 2202 connected to atleast some of ground return conductors 2204 and/or extended outputtongues 2206. Isolator 2202 increases mechanical strength of inductor2200, as well as the planarity of ground return conductors 2204 and/orextended output tongues 2206. FIG. 23 shows inductor 2200 installed on aPCB 2302. Dashed lines indicate the outlines of windings and groundreturn conductors 2204 obscured by a magnetic core 2208 or isolator2202.

FIG. 24 is a top plan view of one coupled inductor 2400, FIG. 25 is aside plan view of coupled inductor 2400 installed on a PCB 2502, andFIG. 26 is a top perspective view of a four winding embodiment ofcoupled inductor 2400. Coupled inductor 2400 is similar to coupledinductor 2200 (FIG. 22). However, in contrast with coupled inductor2200, coupled inductor 2400's magnetic core 2402 does not includefeatures (e.g., gapped outer legs) to boost leakage inductance values.Instead, core 2402 and windings 2404 form a nearly-ideal transformer,and an area or channel 2502 formed by ground return conductors 2406 andextended output tongues 2408 serves as an “air core inductor” whichboosts the leakage inductance values of windings 2404. The air coreadvantageously has close to zero core losses. Isolator 2410 canoptionally be formed of a magnetic material (e.g., a ferrite and/or apowdered iron material) to increase the leakage inductance values ofinductor 2400. Such magnetic material could be selected such thatisolator 2410 at least partially saturates during normal operation ofinductor 2400, thereby resulting in a significant decrease in leakageinductance values at high but normal winding currents. Dashed linesindicate an outline of windings 2404 and ground return conductors 2406where obscured by core 2402 or isolator 2410.

FIG. 27 shows a top plan view of one coupled inductor 2700, and FIG. 28shows a side plan view of coupled inductor 2700 installed on a PCB 2802.Coupled inductor 2700 is similar to inductor 2400 (FIG. 24). However, ininductor 2700, ground return conductors 2702 and extended output tongues2704 are formed at least substantially at the same height with respectto magnetic core 2708 and do not form air core inductors. Isolator 2706is formed of a magnetic material, which may be selected such thatisolator 2706 at least partially saturates during normal operation ofinductor 2700, thereby resulting in a significant decrease in leakageinductance values at high but normal winding currents. Dashed linesindicate the outline of windings and ground return conductors 2702obscured by magnetic core 2708.

In other embodiments, low profile inductors as illustrated in FIG.29-32, 33-35, or 36-38 have a low resistance foil winding, which is forexample in part used to bridge the distance from a height-unrestrictedarea of a PCB to a load.

FIG. 29 shows a side plan view of one inductor 2900 having a low profileinstalled on a PCB 2902, and FIG. 30 shows a top plan view of inductor2900. Inductor 2900 includes an elongated foil winding 2904 disposedabove an elongated foil ground return conductor 2906. Ground returnconductor 2906 is, for example, configured such that it only partiallycontacts a PCB, as shown in FIG. 29. Isolators 2908, 2910 separatewinding 2904 and ground return conductor 2906 such that inductor 2900forms an area or channel 2912 that serves as an air core. Winding 2904and ground return conductor 2906 are, for example, at leastsubstantially parallel along channel 2912. One or more of isolators2908, 2910 may optionally include a magnetic material (e.g., a ferritematerial and/or a powdered iron material) to boost inductance ofinductor 2900. FIG. 31 is a top perspective view of inductor 2900 withisolators 2908, 2910 removed, and FIG. 32 is a top plan view of one PCBfootprint that could be used with inductor 2900. As shown in FIG. 29,one possible application of inductor 2900 is to bridge a heightrestriction 2914 in the vicinity of a load 2916.

FIG. 33 shows a side plan view of one inductor 3300 having a low profileinstalled on a PCB 3302, and FIG. 34 shows a top plan view of inductor3300. Inductor 3300 includes a foil winding 3304 disposed above a foilground return conductor 3306. Inductor 3300 includes at least onemagnetic section 3308 formed of a magnetic material (e.g., a ferritematerial and/or a powdered iron material) disposed on ground returnconductor 3306. Winding 3304 extends through an opening in each magneticsection 3308. Magnetic sections 3308 increase inductance of inductor3300, provide mechanical support, and cause inductor 3300 to be“shielded”. It may be advantageous for inductor 3300 to include a numberof smaller magnetic sections 3308 instead of one large magnetic sectionbecause smaller magnetic sections may facilitate manufacturability,resist cracking, and tolerate PCB flexing, while nevertheless providingsignificant collective core cross section, which helps minimize coreloss in switching power supply applications. Winding 3304 and groundreturn conductor 3306 are shown by dashed lines where obscured bymagnetic sections 3308 in FIGS. 33-34. FIG. 35 shows a top perspectiveview of inductor 3300 with magnetic sections 3308 removed. As shown inFIG. 33, one possible application of inductor 3300 is to bridge a heightrestriction 3310 in the vicinity of a load 3312.

FIG. 36 shows a side plan view of one low profile inductor 3600installed on a PCB 3602, and FIG. 37 shows a top plan view of inductor3600. Inductor 3600 includes a foil winding 3604 disposed between groundreturn conductors 3606, 3608. At least one magnetic section 3610 (e.g.,formed of a ferrite material and/or a powdered iron material) isdisposed between ground return conductors 3606, 3608. Winding 3604 iswound through an opening in each magnetic section 3610 in FIGS. 36-37.For the same reasons as discussed above with respect to inductor 3300(FIGS. 33-35), it may be advantageous for inductor 3600 to include anumber of smaller magnetic sections 3610 instead of one large magneticsection. The outlines of winding 3604 and ground return conductors 3606,3608 are shown by dashed lines where obscured by magnetic sections 3610.FIG. 38 shows a top perspective view of inductor 3600 with magneticsections 3610 removed. Inductor 3600 may allow for use of larger crosssection magnetic sections than inductor 3300 due to ground returnconductors 3606, 3608 being disposed only on the sides of inductor 3600,which allows magnetic sections 3610 to occupy the portion of inductor3600's height that would otherwise be occupied by ground returnconductors. As shown in FIG. 36, one possible application of inductor3600 is to bridge a height restriction 3612 in the vicinity of a load3614.

State of the art switching devices generally have a height of less thanone millimeter when assembled on a PCB. Other commonly used surfacemount components, such as ceramic capacitors, also have a similarly lowheight. Inductors, however, typically have a height of severalmillimeters so that their cores have a sufficiently large cross sectionto keep core losses to an acceptable level.

Accordingly, in height restricted applications, it may be desirable touse a “drop-in” inductor disposed in a PCB aperture. For example, FIG.39 shows a side cross-sectional view of a prior art drop-inductor 3900installed in an aperture 3902 of a PCB 3904. Inductor 3900 includessolder tabs 3906, a magnetic core 3908, and a soft, multi-turn wirewinding (not shown in FIG. 39) wound around core 3908 and connected tosolder tabs 3906.

Inductor 3900 advantageously utilizes the height on both side of PCB3904, as well as the thickness of PCB 3904. However, the aperturerequired for drop-in inductor 3900 reduces the path for return currentthrough ground plane or interconnect layers of the PCB in the vicinityof the inductor, thereby increasing the return path impedance andassociated losses. For example, FIG. 40 shows a top plan view ofinductor 4000 installed in aperture 3902 of PCB 3904. Return currentcannot flow through aperture 3902—accordingly, return current must flowaround aperture 3902, as represented by arrows 4002, which increasesreturn path impedance. Accordingly, with typical drop-in inductors,sufficient space must be provided around aperture 3902 for returncurrent conduction. Additionally, inductance is affected by the returncurrent path, and aperture 3902 will affect the inductance of inductor3900 because return current does not flow under inductor 3900. Thesituation may be amplified in multiphase applications, such as shown inFIG. 41, where a plurality of apertures 4102 in a PCB 4104 are requiredfor prior art drop-in inductors 4100. Apertures 4102 significantlyincrease return path impedance, and significant spacing 4106 betweenapertures 4102 is required to provide a return current path.

Furthermore, inductor 3900 is often fragile when installed in a PCBaperture. In particular, inductor 3900's solder tabs 3906 typicallysupport inductor 3900's entire weight because inductor 3900's core 3908typically does not contact PCB 3904. Accordingly, solder tabs 3906 aretypically subject to significant mechanical stress, and may cause core3908, which is typically formed of a relatively fragile magneticmaterial, to crack.

At least some of the problems discussed above can be reduced oreliminated with a drop-in inductor including one or more ground returnconductors. For example, FIG. 42 shows a side cross-sectional view andFIG. 43 shows a top plan view of one drop-in inductor 4200 installed inan aperture of a PCB 4202. FIG. 44 shows a top perspective view ofinductor 4200.

Inductor 4200 includes a winding 4204 wound at least partially around orthrough at least a portion of a magnetic core 4206 (e.g., formed of aferrite and/or powdered iron material). Winding 4204, for example,extends through a channel in core 4206. FIG. 45 shows a top perspectiveview of inductor 4200 with core 4206 removed. Inductor 4200 alsoincludes ground return conductors 4208, 4210. Outlines of winding 4204and ground return conductors 4208, 4210 are shown by dashed lines inFIG. 43 where obscured by core 4206, and core 4206 is shown astransparent in FIG. 44. Winding 4204 and/or ground return conductors4208, 4210 are, for example, foil conductors, as shown in FIGS. 42-45.Such foil conductors may, but need not be, sufficiently thick to berelatively rigid. Core 4206 does not form a magnetic path loop aroundground return conductors 4208, 4210. Accordingly, inductance of groundreturn conductors 4208, 4210 is, for example, not significantlyincreased by presence of core 4206.

Inductor 4200 can be used, for example, to provide a path for returncurrent, as shown by arrows 4304 in FIG. 43, as well as to provide apath for current to a load, as shown by arrow 4306. Thus, in contrast toprior art drop-in inductors, return current does not need to flow aroundinductor 4200—instead return current can flow through ground returnconductors 4208, 4210 attached to inductor 4200.

In contrast to prior art drop-in inductors, use of inductor 4200 doesnot necessarily increase return path impedance. Ground return conductors4208, 4210 are often of similar thickness to that of winding 4204 andare frequently ten to fifty times thicker than typical PCB trace foilthickness. Use of drop-in inductor 4200 may therefore significantlydecrease return path impedance, despite a PCB aperture being requiredfor inductor 4200. Furthermore, inductance of inductor 4200 is lessaffected by PCB layout than prior art drop-in inductors because returncurrent flows through inductor 4200.

Moreover, because inductor 4200 provides a path for return current, anumber of inductors 4200 can be spaced close together without having toallow for space between inductors for a return current path, such asspacing 4106 required between prior art drop-in inductors 4100 of FIG.41. Ground return conductors 4208, 4210 may even allow a number ofinductors 4200 to be placed in a single aperture. Accordingly, a numberof inductors 4200 may require less space on a PCB than the same numberof prior art drop-in inductors because inductors 4200 can be placedcloser together than the prior art drop-in inductors, or a number ofinductors 4200 can be placed in a common aperture.

Winding 4204 and ground return conductors 4208, 4210, for example, haverespective solder tabs 4302 electrically coupled to their ends tofacilitate surface mount connection of inductor 4200 to a PCB. Soldertabs 4302 are typically formed at the same height relative to a bottomsurface 4212 of core 4206 to facilitate surface mount connection ofinductor 4200 to a PCB. In some embodiments, solder tabs 4302 areextensions of winding 4204 or ground return conductors 4208, 4210, whichmay facilitate manufacturability of inductor 4200. For example, winding4204 and its respective solder tabs 4302 may be formed of a single foilwinding. Each of solder tabs 4302, for example, connect to PCB traces ona common PCB layer.

Inductor 4200 may be more mechanically robust than prior art drop-ininductors. For example, in embodiments where winding 4204 is arelatively rigid foil extending through a channel in core 4206, winding4204 may provide significant mechanical support for inductor 4200. Incontrast, the soft, multi-turn wire winding of prior art drop-ininductor 3900 typically provides little to no mechanical support forinductor 3900.

Additionally, ground return conductor 4208, 4210 may increase mechanicalrobustness of inductor 4200. For example, solder tabs 4302 coupled toground return conductors 4208, 4210 may provide additional points tosupport inductor 4200 on a PCB, thereby reducing stress on inductor4200's solder tabs and consequently reducing the likelihood of core 4206cracking. For example, if each of winding 4204 and ground returnconductors 4208, 4210 have respective solder tabs 4302 coupled to theirends, inductor 4200 may be supported on a PCB at six different places,as opposed to prior art inductor 3900, which is supported at only twoplaces. Furthermore, ground return conductors 4208, 4210 may promoteoverall mechanical strength of inductor 4200.

Drop-in inductors with ground return conductors may have otherconfigurations. For example, FIG. 46 shows a top perspective view of onedrop-in inductor 4600, which is a variation of inductor 4200 (FIGS.42-45). Inductor 4600 includes a winding 4602 wound at least partiallyaround or through at least a portion of a magnetic core 4604 (shown astransparent in FIG. 46). Inductor 4600 further includes ground returnconductors 4606, 4608. FIG. 47 is an exploded perspective view ofinductor 4600 with magnetic core 4604 removed. A respective solder tab4610 may be electrically coupled to each end of winding 4602 and groundreturn conductors 4606, 4608. Each of solder tabs 4610 are, for example,formed at the same height relative to a bottom surface of core 4604 tofacilitate surface mount connection of inductor 4600 to a PCB.

Ground return conductors 4606, 4608 respectively include clamps 4612,4614 which may allow for easier clamping of the ground return conductorsto magnetic core 4604. Clamps 4612, 4614 may also increase robustness,physical attachment strength, and heat sinking ability of ground returnconductors 4606, 4608. FIG. 48 shows a top perspective view of inductor4800, which is an alternate embodiment of inductor 4600 including groundreturn conductors 4802, 4804 that provide enhanced clamping to magneticcore 4806 and enhanced conductivity. Winding 4808 is wound at leastpartially around or though a least a portion of core 4806, and core 4806is shown as transparent in FIG. 48. FIG. 49 is an exploded perspectiveview of inductor 4800 with magnetic core 4806 removed.

The concept of adding ground return conductors to drop-in inductors canbe extended to inductors including multiple, magnetically coupledwindings. For example, FIG. 50 shows a top perspective view of a drop-incoupled inductor 5000 including ground return conductors 5002, 5004.Coupled inductor 5000 further includes windings 5006, 5008 wound atleast partially around or through at least a portion of a magnetic core5010 (shown as transparent in FIG. 50). FIG. 51 is a top perspectiveview of inductor 5000 with magnetic core 5010 removed. A respectivesolder tab 5012 is, for example, electrically coupled to each of groundreturn conductors 5002, 5004, and windings 5006, 5008. Solder tabs 5012are, for example, formed at the same height relative to a bottom surface5014 of core 5010 to facilitate surface mount connection of inductor5000 to a PCB. Although inductor 5000 is shown as being a two windingcoupled inductor, inductor 5000 could be extended to support three ormore windings. Additional ground return conductors could also be added,or ground return conductors 5002, 5004 could be combined into a singleconductor.

FIG. 52 shows a top plan view of one PCB assembly 5200, which shows onepossible application of coupled inductor 5000. In assembly 5200, notonly do windings 5006, 5008 respectively carry current from power stages5202, 5204 to a load, ground return conductor 5004 also carries currentto the load. Ground return conductor 5002, however, serves to carryreturn current.

FIG. 53 shows a top perspective view of one N-winding coupled inductor5300, which is another example of a drop-in inductor including a groundreturn conductor. Inductor 5300 includes N windings 5302, where N is aninteger greater than one. Although inductor 5300 is shown as includingfour windings, inductor 5300 could be modified to include any number ofwindings greater than one. Each winding 5302 is at least partially woundaround a respective leg of a magnetic core 5304. A respective solder tab5306 is electrically coupled to each end of each winding 5300. Soldertabs 5306 allow windings 5302 to be soldered to a PCB that inductor 5300is installed in an aperture of. Solder tabs 5306 are, for example,extensions of their respective windings 5302. FIG. 54 shows a topperspective view of windings 5302.

Inductor 5300 further includes a ground return current conductor in theform of a return current structure 5308 to provide a low impedance pathfor return current. FIG. 55 shows a top perspective view of structure5308. Structure 5308 can also advantageously serve as a heat sink forinductor 5300 and a PCB that inductor 5300 is installed in. Structure5308 includes, for example, several solder tabs 5310 for soldering to aPCB. Solder tabs 5306 and 5310 are, for example, formed at the sameheight relative to a bottom surface 5312 of core 5304 to facilitatesurface mount connection of inductor 5300 to a PCB. Structure 5308optionally includes an isolator 5502 to prevent structure 5308 fromelectrically shorting to windings 5302. Isolator 5502 is, for example, adielectric coating or an isolating layer, such as dielectric tape. Inthe example of FIG. 53, structure 5308 is disposed on the bottom side ofinductor 5300—accordingly, only some of solder tabs 5310 of structure5308 are visible in FIG. 53.

FIG. 56 shows an example of one possible application of inductor 5300.In particular, FIG. 56 is a side cross-sectional view of inductor 5300installed in an aperture of a PCB 5602. The vertical position ofinductor 5300 with respect to PCB 5602 could be varied by changing thedimensions of windings 5302 and structure 5308.

Although return current structure 5308 is disposed on the bottom side ofinductor 5300 in FIGS. 53 and 56, structure 5308 could alternatelydisposed on the top side of inductor 5300, as shown in FIG. 57. Placingstructure 5308 on the top side advantageously offers a flat (orsubstantially flat) surface to permit pick and place installation ofinductor 5300 without a top side label. Placing structure 5308 on thetop side of inductor 5300 may also facilitate cooling when there is moreair flow on a particular side of the PCB.

Although structure 5308 is shown as a ground current return conductor,it could be modified to carry additional signals. For example, analternate embodiment of structure 5308 includes two electricallyisolated electrical conductors, where one conductor serves as a groundreturn conductor, and the other conductor serves as a low current powersupply conductor (e.g., a conductor for a keep-alive power supply).

FIG. 58 shows a top perspective view of one drop-in N-winding coupledinductor 5800, where N is an integer greater than one. Inductor 5800 issimilar to inductor 5300 (FIG. 53); however windings 5802 of inductor5800 have a shorter length and thus a lower resistance than windings5302 of inductor 5300. FIG. 59 shows a top perspective view of onewinding 5802 which is, for example, symmetrical in order to reducewinding length. Inductor 5800 includes a magnetic core 5804, and arespective solder tab 5806 is electrically coupled to each end of eachwinding 5802. Similar to inductor 5300, inductor 5800 includes a groundreturn structure 5808, which, for example, includes several solder tabs5810. Solder tabs 5806 and 5810 may be formed at the same heightrelative to a bottom surface 5812 of core 5804 to facilitate surfacemount connection of inductor 5800 to a PCB.

Core 5804 is, for example, formed of pairs of corresponding magneticelements 5814, 5816 and 5818, 5820, as shown in FIG. 58. In suchembodiments, solder tabs 5806 extend from spaces between correspondingmagnetic elements 5814, 5816 and 5818, 5820. In embodiments wherewindings 5802 are symmetrical, each of corresponding magnetic elements5814, 5816 and 5818, 5820 have, for example, an identical shape andsize.

FIG. 60 shows an example of one possible application of inductor 5800.In particular, FIG. 60 is a side cross-sectional view of inductor 5800installed in an aperture of a PCB 6002. The vertical position ofinductor 5800 with respect to PCB 6002 could be varied by changing thedimensions of windings 5802 and structure 5808. Although ground returnstructure 5808 is installed on the bottom side of inductor 5800 in FIGS.58 and 60, structure 5808 could be installed on the top side of inductor5800, as shown in FIG. 61.

As discussed above, use of prior art drop-in inductors typically resultsin problems including significantly increased return current pathimpedance, poor mechanical robustness, and the need to separate multipleinstances of the prior art drop-in inductors. However, drop-in inductorswith ground return conductors, such as some embodiments of the inductorsdiscussed above, may reduce or eliminate one or more of these problems,as previously discussed. Accordingly, the addition of ground returnconductors to drop-in inductors may allow for use of drop-in inductorsin applications where prior art drop-in inductors would be impractical.Use of drop-in inductors instead of standard (non drop-in) surface mountinductors may offer a number of advantages, such the following: (1)reduced inductor height relative to the PCB surface; (2) increasedinductor core size and cross section, which helps minimize core loss;(3) reduced PCB surface area required for the inductors; and/or (4)inductor height being closer to that of other power supply components,resulting in improved power supply volume utilization.

Adding one or more ground return conductors to a drop-in inductor mayalso significantly reduce or eliminate inductance dependence on layoutand/or PCB aperture configuration. In particular, adding one or moreground return conductors to a drop-in inductor helps minimize length ofthe inductor's current loop in output inductor applications, where thecurrent loop is defined by the path current takes when flowing throughthe inductor to a load, and from the load back by the inductor.Inductance is affected by the current loop's configuration, andincreasing the current loop's size generally increases inductance.Accordingly, by minimizing current loop length through use of groundreturn conductors, current loop length may be significantly orcompletely unaffected by PCB layout and/or aperture configuration,thereby reducing or eliminating inductance dependence on suchapplication characteristics. In contrast, in the prior art drop-ininductor of FIGS. 39-41, current loop size is significantly dependent onPCB layout and aperture configuration. For example, in the case of priorart inductor 3900 (FIGS. 39-40), inductor 3900's inductance will changeif the size of aperture 3902 or the PCB layout around aperture 3902 ischanged.

FIGS. 62-64 respectively show a perspective, a side plan, and a top planview of an inductor 6200. Inductor 6200 is similar to inductor 500 (FIG.5), but with foil extended input and output tongues 6202, 6204 of atleast substantially the same length. Inductor 6200 includes a foilwinding 6206 and a core 6208 formed of magnetic material. Core 6208 hasa first side 6210 opposite to a second side 6212. A linear separationdistance between first and second sides 6210, 6212 of core 6208 definesa length 6214 of core 6208.

Foil winding 6206 includes a core winding portion 6216 wound throughcore 6208. Extended input and output tongues 6202, 6204 are electricallycoupled to opposite respective ends of foil winding 6206. In certainembodiments, input and output tongues 6202, 6204 are each an extensionof winding 6206. Input tongue 6202 is at first side 6210 of core 6208and extends away from core 6208 in a lengthwise direction 6218, andoutput tongue 6204 is at second side 6212 of core 6208 and extends awayfrom core 6208 in lengthwise direction 6218. Dashed lines indicate theoutline of winding 6206 where obscured by core 6208. Extended input andoutput tongues 6202, 6204, for example, supplement or serve as asubstitute for respective foil traces disposed on a surface of a printedcircuit board. For example, one or more of input and output tongues6202, 6204 may be configured for soldering to and extending alongrespective PCB foil traces.

Extended input tongue 6202 has a length 6220, and extended output tongue6204 has a length 6222. Length 6220 is at least substantially equal tolength 6222. In certain embodiments, each of lengths 6220, 6222 oftongues 6202, 6204 are less than length 6214 of core 6208. Each oftongues 6202, 6204 are formed at a same height relative to a bottomsurface 6224 of core 6208 to facilitate surface mount soldering oftongues 6202, 6204 to a PCB.

FIGS. 65-67 respectively show a perspective, a side plan, and a top planview of an inductor 6500, which is an alternate embodiment of inductor6200 (FIGS. 62-64), and includes two ground return conductors 6502,6504. Inductor 6500 is similar to inductor 1500 (FIGS. 15-17), but withground return conductor extensions and extended input and output tonguesof at least substantially equal length. Ground return conductors 6502,6504 attach to bottom surface 6224 of core 6208, and core 6208 does notform a magnetic path loop around ground return conductors 6502, 6504.Accordingly, inductance of ground return conductors 6502, 6504 is notsignificantly increased by presence of core 6208, while inductance ofwinding 6206 is increased by presence of core 6208, relative to anotherwise identical inductor without core 6208. As can be seen in FIGS.65 and 67, ground return conductors 6502, 6504 are each adjacent foilwinding 6206 in lengthwise direction 6218.

Both of ground return conductors 6502, 6504 include a respective firstextension 6506, 6508 at first side 6210 of core 6208 and extending awayfrom core 6208 in lengthwise direction 6218. Similarly, both of groundreturn conductors 6502, 6504 include a respective second extension 6510,6512 at second side 6212 of core 6208 and extending away from core 6208in lengthwise direction 6218. Each extension 6506, 6508, 6510, 6512, aswell as extended input and output tongues 6202, 6204, are formed at asame height relative to bottom surface 6224 of core 6208 to facilitatesurface mount soldering to a PCB. Each first extension 6506, 6508 hasthe same length 6220 as extended input tongue 6202, and each secondextension 6510, 6512 has the same length 6222 as extended output tongue6204. As discussed above, each of extended input and output tongues6202, 6204 has the same length, and each extension 6506, 6508, 6510,6512 therefore has the same length as each tongue.

FIG. 68 shows a perspective view of an inductor 6800, which is similarto inductor 6500 (FIGS. 65-67), but with an alternative ground returnconductor configuration. Inductor 6800 includes ground return conductors6802, 6804, which are similar to the ground return conductors ofinductor 6500, but extend up at least partially along sides 6210, 6212,6806, 6808 of core 6208, as shown in FIG. 68. Such extensions of groundreturn conductors 6802, 6804 along sides of core 6208 advantageouslypromote mechanical robustness of inductor 6800 and also increase theeffective cross sectional area of ground return conductors 6802, 6804.Increased ground return conductor 6802, 6804 cross sectional areapromotes low impedance of the ground return conductors, as well ascooling of inductor 6800 and a PCB in contact with inductor 6800.Furthermore, the portions of ground return conductors 6802, 6804 thatextend along sides of core 6208 are exposed (i.e., do not contact a PCB)in typical applications, and therefore are particularly effective incooling inductor 6800.

In certain embodiments of the inductors disclosed herein, the core isformed of a powder magnetic material, such as powdered iron within abinder, and the one or more windings are at least partially embedded inthe core. For example, FIG. 69 shows a perspective view of inductor6900, which is similar to inductor 6200 (FIGS. 62-64), but with foilcore winding portion 6216 replaced with a wire core winding portion 6902embedded in core 6208. As another example, FIG. 70 shows a perspectiveview of inductor 7000, which is similar to inductor 6500 (FIGS. 65-67),but with foil core winding portion 6216 replaced with a wire corewinding portion 7002 embedded in core 6208.

FIG. 72 shows a drop-in coupled inductor 7200 including a core 7202formed of a magnetic material and a leakage plate 7204 formed of amagnetic material. FIG. 73 shows inductor 7200 with leakage plate 7204separated from the remainder of the inductor, and FIG. 74 shows core7202 as transparent.

Core 7202 has opposing top and bottom surfaces 7206, 7208, and leakageplate 7204 has opposing top and bottom surfaces 7210, 7212 (see FIG.73). Core 7202 further includes opposing first and second sides 7214,7216, each generally perpendicular to core top and bottom surfaces 7206,7208 and separated by a linear separation distance 7218 (see FIG. 74).Leakage plate 7204 is disposed on core 7202 such that leakage platebottom surface 7212 faces core top surface 7206. As discussed below,there is typically a slight separation between core 7202 and leakageplate 7204 to set and control inductance values.

Drop-in coupled inductor 7200 further includes first and second windings7220, 7222 and first and second ground return conductors 7224, 7226.FIG. 75 shows an exploded perspective view of inductor 7200, withleakage plate 7204 and ground return conductors 7224, 7226 separatedfrom the remainder of inductor 7200, and with core 7202 shown astransparent. FIG. 76 shows a perspective view of windings 7220, 7222.

First winding 7220 is wound through core 7202 with portions 7228, 7230alternately disposed on core bottom and top surfaces 7208, 7206. Secondwinding 7222 is also wound through core 7202, but with portions 7232,7234 alternately disposed on core bottom and top surfaces 7208, 7206 ina manner opposite to that of first winding 7220. In particular, firstand second portions 7228, 7230 of first winding 7220 are disposed oncore bottom and top surfaces 7208, 7206, respectively, while first andsecond portions 7232, 7234 of second winding 7222 are disposed on corebottom and top surfaces 7208, 7206, respectively. Thus, first portion7228 is immediately adjacent to second portion 7234 in the lengthwise7218 direction, and second portion 7230 is immediately adjacent to firstportion 7232 in the lengthwise 7218 direction. Accordingly, each winding7220, 7222 is wound around a respective winding axis 7236, 7238extending through core 7202, where axes 7236, 7238 are offset and aresubstantially parallel (see FIG. 75).

Inductor 7200's configuration causes windings 7220, 7222 to have“inverse” or “reverse” magnetic coupling. Such magnetic coupling ischaracterized, for example, by current of increasing magnitude flowinginto first winding 7220 from core first side 7214 inducing a current ofincreasing magnitude flowing into second winding 7222 from core firstside 7214. In other words, current of increasing magnitude flowingthrough first winding 7220 from core first side 7214 to core second side7216 induces current of increasing magnitude flowing through secondwinding 7222 from core first side 7214 to core second side 7216.

Ground return conductors 7224, 7226 are disposed on core bottom surface7208 and wrap around core sides 7214, 7216. Neither core 7202 norleakage plate 7204 forms a magnetic path loop around ground returnconductors 7224, 7226. Accordingly, inductance of ground returnconductors 7224, 7226 is not significantly increased by presence of core7202 and leakage plate 7204, while inductance of windings 7220, 7222 issignificantly increased by presence of core 7202 and leakage plate 7204,relative to an otherwise identical inductor without the core and leakageplate. Although it is anticipated that ground return conductors 7224,7226 will typically carry return current from a load back to an electricpower source, one or more of ground return conductors 7224, 7226 couldbe used for another purpose, such as to electrically couple a load to anauxiliary electric power source.

Each of first and second windings 7220, 7222 has opposing first andsecond ends respectively forming a first solder tab 7240, 7242 and asecond solder tab 7244, 7246. Each first solder tab 7240, 7242 isdisposed at core first side 7214 and extends away from core 7202 in thelengthwise 7218 direction. Each second solder tab 7244, 7246, on theother hand, is disposed at core second side 7216 and extends way fromcore 7202 in the lengthwise 7218 direction. Each of first and secondground return conductors 7224, 7226 has opposing first and second endsrespectively forming a first ground return solder tab 7248, 7250 and asecond ground return solder tab 7252, 7254. Each first ground returnsolder tab 7248, 7250 is disposed at core first side 7214, and eachsecond ground return solder tab 7252, 7254 is disposed at core secondside 7216. In some embodiments, ground return solder tabs 7248, 7250,7252, 7254 extend away from core 7202 in the lengthwise 7218 direction,as shown in FIGS. 73-75.

Although each solder tab 7240-7254 is shown as having the sameconfiguration, two or more solder tab instances could have differentconfigurations. For example, in an alternate embodiment, first soldertabs 7240, 7242 are longer than second solder tabs 7244, 7246. Eachsolder tab 7240-7254 is offset by a common distance 7256 from corebottom surface 7208 (see FIG. 74). In other words, each solder tab7240-7254 is disposed in a common plane between core bottom surface 7208and leakage plate top surface 7210 to facilitate use of inductor 7200 asa drop-in inductor in a PCB aperture.

Leakage plate 7204 provides a path for leakage magnetic flux, which isflux generated by current flowing through one of windings 7220, 7222that does not link the other of windings 7220, 7222. Thus, leakage plate7204 boosts leakage inductance associated with windings 7220, 7222,thereby allowing windings 7220, 7222 to be placed very close together incore 7202, while still achieving relatively large leakage inductancevalues. Placement of windings 7220, 7222 close together, in turn,promotes small inductor foot print size. In prior art coupled inductor7100 (FIG. 71), in contrast, a non-negligible separation distance 7110typically separates windings 7102, 7104 to achieve sufficiently largeleakage inductance values.

Leakage inductance values can be adjusted during inductor design and/orconstruction without adjusting winding configuration and/or placement byvarying the separation distance between leakage plate 7204 and core7202. Leakage inductance is approximately inversely proportional tospacing between core 7202 and leakage plate 7204, and these two magneticelements are typically separated from each other by winding portions7230, 7234 and/or by an air gap. A non-magnetic spacer (not shown), suchas a paper, plastic, or adhesive, is optionally disposed between leakageplate 7204 and core 7202 to increase their separation distance.

Leakage plate 7204 optionally extends over some or all of solder tabs7240-7254, such that the solder tabs extend along leakage plate bottomsurface 7212. Such configuration promotes solder tab planarity andstrong mechanical coupling of inductor 7200 to a PCB. For example, FIG.77 shows a cross-sectional view of a printed circuit assembly 7700including drop-in coupled inductor 7200 installed in a PCB 7702 aperture7704. Leakage plate 7204 overlaps PCB portions 7706, thereby promotingstrong mechanical coupling of inductor 7200 to PCB 7702 and assembly7700 mechanical robustness.

FIG. 78 shows a PCB footprint 7800, which is one possible footprint foruse with inductor 7200 in a multi-phase buck converter application, suchas in a converter having a schematic similar to that of FIG. 2. In thisembodiment, inductor 7200 installs in an aperture 7802 of a PCB 7804.Solder tabs 7240-7254 respectively couple PCB pads 7806-7820. Not shownin FIG. 78 are buck converter switching devices electrically coupled toswitching nodes Vx and a load electrically coupled to output node Vo. Asshown by arrows IL1 and IL2, windings 7220, 7222 provide a path forcurrent from an electrical power source, which is modulated by the buckconverter switching devices, to a load. On the other hand, ground returnconductors 7224, 7226 provide a path for return current from the loadback to the electric power source, as shown by arrows Ignd. Inductor7200 is not limited to use with footprint 7800 or in multi-phase buckconverter applications. For example, inductor 7200 could be used inother topologies such as boost converters and buck-boost converters.

In some alternate embodiments, first and second ground return conductors7224, 7226 are substituted with a single ground return conductor. Forexample, FIG. 79 shows a ground return conductor 7902, which is used inplace of ground return conductors 7224, 7226 in certain alternateembodiments. Opposing first and second ends of ground return conductor7902 respectively form first ground return solder tabs 7904, 7906 andsecond ground return solder tabs 7908, 7910. FIG. 80 shows a perspectiveview of core 7202 shown as transparent and including single groundreturn conductor 7902, instead of dual ground return conductors 7224,7226. An insulator (not shown) separates ground return conductor 7902from windings 7220, 7222 along core bottom surface 7208.

Ground return conductor 7902 substantially covers core bottom surface7208, thereby acting as a shield. Ground return conductor 7902's largesurface area also promotes cooling of inductor 7200 and other componentsin its vicinity, as well as mechanical robustness of inductor 7200 andan assembly it is installed in. Single ground return conductor 7902 anddual ground return conductors 7224, 7226 could be adapted to work with acommon PCB footprint, such as footprint 7800 (FIG. 78), thereby enablinginterchangeability of inductors with different ground return conductors.

In some other alternate embodiments, one or more ground returnconductors are disposed on leakage plate top surface 7210 as well as oncore bottom surface 7208, or on leakage plate top surface 7210 insteadof on core bottom surface 7208. For example, FIG. 81 shows a perspectiveview of a drop-in coupled inductor 8100, which is similar to inductor7200 (FIG. 72), but with dual ground return conductors 7224, 7226replaced with a ground return conductor 8102 disposed on leakage platetop surface 7210. Opposing first and second ends of ground returnconductor 8102 respectively form first ground return solder tabs 8104,8106 and second ground return solder tab 8108. Ground return conductor8102's second end also forms an additional second ground return soldertab that is not visible in the perspective view. FIG. 82 shows leakageplate 7204 and ground return conductor 8102 without the remainder ofinductor 8100. Core 7202 and leakage plate 7204 are shown as transparentin FIGS. 81-82.

Ground return conductor 8102 substantially covers leakage plate topsurface 7210, thereby providing a low impedance path for return current,for example. The large surface area of ground return conductor 8102 alsopromotes cooling and mechanical robustness in a manner similar thatdiscussed above with respect to FIGS. 79 and 80. Ground return conductor8102 could be adapted for footprint compatibility with dual groundreturn conductors 7224, 7226 (FIGS. 72 and 74) and/or single groundreturn conductor 7902 (FIG. 79), thereby promoting inductorinterchangeability.

Core 7202 and leakage plate 7204 may each be single piece magneticelements as shown, such as single piece ferrite or powdered ironmagnetic elements. For example, in some embodiments, core 7202 is formedof powder iron within a binder with first and second windings 7220, 7222embedded therein. Alternately, one or more of core 7202 and leakageplate 7204 are formed of two or more pieces. For example, FIG. 83 showsa top plan view of a core 8300, which is an embodiment of core 7202formed of two discrete magnetic elements 8302, 8304 joined together.Discrete magnetic elements 8302, 8304 collectively form a passageway8306 through which windings 7220, 7222 pass.

FIG. 84 shows a perspective view of a drop-in coupled inductor 8400,which is similar to coupled inductor 8100 (FIG. 81), but with leakageplate 7204 and ground return conductor 8102 replaced with a leakageplate 8404 and ground return conductor 8402, respectively. FIG. 85 showsa perspective view of coupled inductor 8400 with leakage plate 8404separated from core 7202, and with leakage plate 8404 and core 7202shown as transparent. In contrast to coupled inductor 8100, leakageplate 8402 of coupled inductor 8400 does not extend over winding soldertabs 7240-7246 or ground return solder tabs 8406-8412. Suchconfiguration allows for a smaller leakage plate and ground returnconductor than in inductor 8100, assuming all else is equal, therebypromoting material conservation and low cost. The fact that leakageplate 8404 does not extend over the solder tabs enables simultaneouspressing or stamping of both winding solder tabs 7240-7246 and groundreturn solder tabs 8406-8412, while manufacturing certain embodiments ofcoupled inductor 8400. In some embodiments, solder tab pressing orstamping is performed while forming other parts of coupled inductor8400, such as while curing core 7202 and/or leakage plate 8404, therebypromoting manufacturing efficiency.

FIG. 86 shows a perspective view of a coupled inductor 8600, which isanother drop-in coupled inductor. Inductor 8600 is shown as includingthree windings, or being a “three-phase” inductor. However, inductor8600 can be modified to have a different number of windings, andinductor 8600 can thus be adapted to support N phases, where N is aninteger greater than one.

Similar to inductor 7200 (FIG. 72), inductor 8600 includes a core 8602and a leakage plate 8604, each formed of a magnetic material. FIG. 87shows inductor 8600 with leakage plate 8604 separated from core 8602,and FIG. 88 shows core 8602 as transparent. Core 8602 has opposing topand bottom surfaces 8606, 8608, and leakage plate 8604 has opposing topand bottom surfaces 8610, 8612. Core 8602 includes opposing first andsecond sides 8614, 8616, separated by a linear separation distance 8618,and each generally perpendicular to core top and bottom surfaces 8606,8608 (see FIG. 87). Leakage plate 8604 is disposed on core 8602 suchthat leakage plate bottom surface 8612 faces core top surface 8606. Asmall separation distance typically separates leakage plate 8604 fromcore 8602 to boost leakage inductance values, in a manner similar tothat discussed above with respect to inductor 7200 (FIG. 72).

Drop-in coupled inductor 8600 includes three windings 8620 wound arounda different portion of core 8602. Each winding 8620 is wound around arespective winding axis 8622 extending through core 8602, where windingaxes 8622 are offset from each other and are substantially parallel toeach other. Opposing first and second ends of each winding 8620respectively form first and second solder tabs 8624, 8626. Althoughsolder tabs 8624, 8626 are shown as having the same configuration,solder tab configuration may vary among solder tab 8624, 8626 instances.Windings 8620 have inverse or reverse magnetic coupling.Consequentially, current of increasing magnitude flowing into one ofwindings 8620 from core first side 8614 induces current of increasingmagnitude flowing into each other of windings 8620 from core first side8614. In other words, current of increasing magnitude flowing throughone of windings 8620 from core first side 8614 to core second side 8616induces current of increasing magnitude flowing through the remainingwindings 8620 from core first side 8614 to 8616.

Drop-in coupled inductor 8600 further includes a ground return conductor8628 disposed on leakage plate top surface 8610 and wrapping around thesides of leakage plate 8604. FIG. 89 shows a perspective view of groundreturn conductor 8628. Neither core 8602 nor leakage plate 8604 forms amagnetic path loop around ground return conductor 8628. Accordingly,inductance of ground return conductor 8628 is not significantlyincreased by presence of core 8602 and leakage plate 8604, whileinductance of windings 8620 is significantly increased by presence ofcore 8602 and leakage plate 8604, relative to an otherwise identicalinductor without the core and leakage plate. Although it is anticipatedthat ground return conductor 8628 will typically carry return currentfrom a load back to an electric power source, ground return conductor8628 could be used for another purpose, such as to electrically couple aload to an auxiliary electric power source.

Opposing first and second ends of ground return conductor 8628respectively form first and second ground return solder tabs 8630, 8632(see FIG. 89). First ground return solder tabs 8630 are disposed at corefirst side 8614, and second ground return solder tabs 8632 are disposedat core second side 8616. Although only a single second ground returnsolder tab 8632 is visible in the perspective view of FIG. 89, manyground return conductor 8628 embodiments form two or more second groundreturn solder tabs 8632. Ground return conductor 8628 substantiallycovers leakage plate top surface 8610, thereby acting as a shield andhelping cool inductor 8600 and components in its vicinity. In certainalternate embodiments, single ground return conductor 8628 is replacedwith multiple ground return conductors and/or disposed on core bottomsurface 8608.

Leakage plate 8604 typically extends over some or all of first andsecond solder tabs 8624, 8626 and of first and second ground returnsolder tabs 8630, 8632, thereby promoting solder tab planarity andmechanical robustness. First and second solder tabs 8624, 8626 and firstand second ground return solder tabs 8630, 8632 are each offset by acommon distance 8634 from core bottom surface 8608 (see FIGS. 86 and88). In other words, each solder tab 8624, 8626, 8630, 8632 is disposedin a common plane between core bottom surface 8608 and leakage plate topsurface 8610 to facilitate use of inductor 8600 as a drop-in inductor ina PCB aperture.

In a manner similar to that discussed above with respect to inductor7200, leakage plate 8604 provides a path for leakage magnetic flux,which is flux generated by current flowing through one of windings 8620that does not link the others of windings 8620. Thus, leakage plate 8604boosts leakage inductance values associated with windings 8620, therebyallowing windings 8620 to be placed close together in core 8602 whilestill achieving relatively large leakage inductance values.

Leakage inductance values can be adjusted during inductor design and/orconstruction without adjusting winding configuration and/or placement byvarying the separation distance between leakage plate 8604 and core8602. Leakage inductance is approximately inversely proportional tospacing between core 8602 and leakage plate 8604, and these two magneticelements are typically separated from each other by portions of windings8620 and/or by an air gap. A non-magnetic spacer (not shown), such as apaper, plastic, or adhesive, is optionally disposed between leakageplate 8604 and core 8602 to increase their separation distance.

FIG. 90 shows a cross-sectional view of printed circuit assembly 9000including drop-in coupled inductor 8600 installed in a PCB 9002 aperture9004. Leakage plate 8604 overlaps PCB 9002 portions 9006, therebypromoting strong mechanical coupling of inductor 8600 to PCB 9002 andmechanical robustness of assembly 9000.

FIG. 91 shows a PCB footprint 9100, which is one possible footprint foruse with inductor 8600 in a three-phase buck converter application, suchas in a converter having a schematic similar to that of FIG. 2. Inductor8600 installs in an aperture 9102 of a PCB 9104. First and second soldertabs 8624, 8626 respectively couple to PCB pads 9106, 9108, and firstand second ground return solder tabs 8630, 8632 respectively couple toPCB pads 9110, 9112. Not shown in FIG. 91 are buck converter switchingdevices electrically coupled to switching nodes Vx and a loadelectrically coupled to output node Vo. As shown by arrows IL1-IL3,windings 8620 provide a path for current from an electrical powersource, which is modulated by the buck converter switching devices, to aload. On the other hand, ground return conductor 8628 provides a pathfor return current from the load back to the electric power source, asshown by arrows Ignd. Footprint 9100 could be modified to accommodate adifferent number of phases. Inductor 8600 is not limited to use withfootprint 9100 or in multi-phase buck converter applications. Forexample, inductor 8600 could be used in other topologies, such as boostconverters and buck-boost converters.

FIG. 92 shows a perspective view of a drop-in coupled inductor 9200.Coupled inductor 9200 is similar to coupled inductor 8600 (FIG. 86) butwith a leakage plate 9204 that does not extend over the inductor'ssolder tabs. Coupled inductor 9200 includes a ground return conductor9228 disposed on a leakage plate top surface 9210. Opposing first andsecond ends of ground return conductor 9228 respectively form first andsecond ground return solder tabs 9230, 9232. First ground return soldertabs 9230 are disposed at core first side 9214, and second ground returnsolder tabs 9232 are disposed at core second side 9216. FIG. 93 showsinductor 9200 with leakage plate 9204 separated from core 8602, and FIG.94 also shows inductor 9200 with leakage plate 9204 separated from core8602, but with both the leakage plate and core shown as transparent.Although coupled inductor 9200 is shown as having two instances ofwindings 8620, inductor 9200 could be modified to have additionalwinding 8620 instances.

The fact that leakage plate 9228 does not extend over the solder tabsenables simultaneous pressing or stamping of both winding solder tabs8624, 8626 and ground return solder tabs 9230, 9232 while manufacturingcertain embodiments of coupled inductor 9200. In some embodiments,solder tab pressing or stamping is performed while forming other partsof coupled inductor 9200, such as while curing core 8602 and/or leakageplate 9204, thereby promoting manufacturing efficiency.

FIG. 95 shows a perspective view of a coupled inductor 9500, which isanother drop-in coupled inductor including a ground return conductor.Inductor 9500 includes a magnetic core including a first magneticelement 9502 and a second magnetic element 9504. FIG. 96 shows aperspective view of inductor 9500 with second magnetic element 9504separated from first magnetic element 9502. First magnetic element 9502includes opposing top and bottom surfaces 9506, 9508, and secondmagnetic element 9504 includes opposing top and bottom surfaces 9510,9512 (see FIG. 96). Second magnetic element 9504 is disposed on firstmagnetic element 9502 such that second magnetic element bottom surface9512 faces first magnetic element top surface 9506. First magneticelement 9502 further includes opposing first and second sides 9514, 9516separated by a linear separation distance 9518. First and second sides9514, 9516 are each generally perpendicular to first magnetic elementtop and bottom surfaces 9506, 9508. FIG. 97 shows inductor 9500 withfirst and second magnetic elements 9502, 9504 shown as transparent, andFIG. 98 shows inductor 9500 with first and second magnetic elements9502, 9504 separated and shown as transparent.

Coupled inductor 9500 further includes first and second windings 9520,9522 disposed on first magnetic element top surface 9506. First andsecond windings 9520, 9522 cross along top surface 9506, and areseparated by an insulator (not shown) at least where the windings cross.In some embodiments, the insulator is an insulating film disposed on oneor both of first and second windings 9520, 9522. In other embodiments,the insulator is a discrete element, such as a plastic sheet, disposedbetween first and second windings 9520, 9522. FIG. 99 shows windings9520, 9522 separated from each other. Arrow 9902 represents how firstwinding 9520 is disposed on second winding 9522 such that the windingscross. In alternate embodiments, second winding 9522 is disposed onfirst winding 9520. Each winding 9520, 9522 has opposing first andsecond ends respectively forming a first and second solder tab 9524,9526. Each first solder tab 9524 is disposed at first side 9514 andextends away from first magnetic element 9502 in the lengthwise 9518direction. On the other hand, each second solder tab 9526 is disposed atsecond side 9516 and extends away from first magnetic element 9502 inthe lengthwise 9518 direction.

Inductor 9500 additionally includes a ground return conductor 9528disposed on second magnetic element top surface 9510. Neither first norsecond magnetic element 9502 or 9504 forms a magnetic path loop aroundground return conductor 9528. Accordingly, inductance of ground returnconductor 9528 is not significantly increased by presence of first andsecond magnetic elements 9502, 9504, while inductance of windings 9520,9522 is increased by presence of first and second magnetic elements9502, 9504, relative to an otherwise identical inductor without themagnetic elements. Although it is anticipated that ground returnconductor 9528 will typically carry return current from a load back toan electric power source, ground return conductor 9528 could be used foranother purpose, such as to electrically couple a load to an auxiliaryelectric power source. Ground return conductor 9528 substantially coverssecond magnetic element top surface 9510, thereby acting as a shield andhelping cool inductor 9500 and other components in its vicinity. Incertain alternate embodiments, single ground return conductor 9528 isreplaced with multiple ground return conductors and/or disposed on firstmagnetic element bottom surface 9508.

Opposing ends of ground return conductor 9528 respectively form firstand second ground return solder tabs 9530, 9532. First ground returnsolder tabs 9530 are disposed at first side 9514, and second groundreturn solder tabs 9532 are disposed at second side 9516. Secondmagnetic element 9504 typically extends over some or all of first andsecond solder tabs 9524, 9526 and first and second ground return soldertabs 9530, 9532, thereby promoting solder tab planarity and mechanicalrobustness. First and second solder tabs 9524, 9526 and first and secondground return solder tabs 9530, 9532 are each offset by a commondistance 9534 from first magnetic element bottom surface 9508 (see FIGS.95 and 96). In other words, each solder tab 9524, 9526, 9530, 9532 isdisposed in a common plane between first magnetic element bottom surface9508 and second magnetic element top surface 9510 to facilitate use ofinductor 9500 as a drop-in inductor in a PCB aperture.

FIG. 100 shows a cross-sectional view of a printed circuit assembly10000 including drop-in coupled inductor 9500 installed in a PCB 10002aperture 10004. Second magnetic element 9504 overlaps PCB 10002 portions10006, thereby promoting strong mechanical coupling of inductor 9500 toPCB 10002 and mechanical robustness of assembly 10000.

FIG. 101 shows a PCB footprint 10100, which is one possible footprintfor use with inductor 9500 in a two-phase buck converter application,such as in a converter having a schematic similar to that of FIG. 2.Inductor 9500 installs in an aperture 10102 of a PCB 10104. First andsecond solder tabs 9524, 9526 respectively couple to PCB pads 10106,10108, and first and second ground return solder tabs 9530, 9532respectively couple to PCB pads 10110, 10112. Not shown in FIG. 101 arebuck converter switching devices electrically coupled to switching nodesVx and a load electrically coupled to output node Vo. As shown by arrowsIL1 and IL2, windings 9522, 9520 provide a path for current from anelectrical power source, which is modulated by the buck converterswitching devices, to a load. Thus, the two switching stages willtypically be disposed on opposing sides of inductor 9500 to be neartheir respective Vx terminals. Ground return conductor 9528 provides apath for return current from the load back to the electric power source,as shown by arrows Ignd. Inductor 9500 is not limited to use withfootprint 10100 or in multi-phase buck converter applications. Forexample, inductor 9500 could be used in other topologies such as boostconverters and buck-boost converters.

First and second magnetic elements 9502, 9504 collectively provide apath for magnetic flux linking first and second windings 9520, 9522. Themagnetic elements also provide a path for leakage magnetic flux, whichis magnetic flux generated by current flowing through one of windings9520, 9522 that does not link the other of windings 9520, 9522. Inparticular, portions 9536, 9538 of inductor 9500 between windings 9520,9522 provide a path for leakage magnetic flux. Leakage inductanceassociated with windings 9520, 9522 can be adjusted during inductordesign and/or manufacture by varying the size and/or configuration ofportions 9536, 9538. For example, FIG. 102 shows a top plan view of analternative embodiment of first magnetic element 9502 including magneticextensions 10202, 10204 in portions 9536, 9538, respectively. Extensions10202, 10204 extend from first magnetic element 9502 to second magneticelement 9504 to decrease leakage magnetic path reluctance, therebypromoting increased leakage inductance. In some embodiments, extensions10202, 10204 are separated from first magnetic element 9502 and/orsecond magnetic element 9504 by an air gap or a gap filled withnon-magnetic material. Leakage inductance values can be adjusted bychanging gap thickness. FIG. 103 shows a plan view of a side 10206 ofthe magnetic element.

FIG. 104 shows a perspective view of second magnetic element 9504including an alternative ground return conductor 10402. Ground returnconductor 10402 covers substantially all of second magnetic element topsurface 9510, but in contrast to ground return conductor 9528 (FIGS.95-98), includes ground return solder tabs 10404 on opposing sides10406, 10408 of second magnetic element 9504. FIG. 105 shows a PCBfootprint 10500, which is one possible footprint for use with inductor9500 including ground return conductor 10402 (FIG. 104) in a two-phasebuck converter application. Inductor 9500 installs in an aperture 10502of a PCB 10504. First and second solder tabs 9524, 9526 respectivelycouple to PCB pads 10506, 10508, and ground return solder tabs 10404respectively couple to PCB pads 10510. Not shown in FIG. 105 are buckconverter switching devices electrically coupled to switching nodes Vxand a load electrically coupled to output node Vo. As shown by arrowsIL1 and IL2, windings 9522, 9520 provide a path for current from anelectrical power source, which is modulated by the buck converterswitching devices, to a load. Ground return conductor 10402 provides apath for return current from the load back to the electric power source,as shown by arrows Ignd.

FIG. 106 shows a perspective view of another drop-in coupled inductor10600, which is similar to coupled inductor 9500 (FIG. 95), but hasdifferent magnetic flux paths. Coupled inductor 10600 includes first andsecond magnetic elements 10602, 10604. First magnetic element 10602 hasopposing top and bottom surfaces 10606, 10608, and second magneticelement 10604 has opposing top and bottom surfaces 10610, 10612. FIG.107 shows inductor 10600 with first and second magnetic elements 10602,10604 separated. First and second magnetic elements 10602, 10604 areshown as transparent in FIGS. 106, 107.

Coupled inductor 10600 further includes first and second windings 10614,10616 disposed on first magnetic element top surface 10606. First andsecond windings 10614, 10616 also cross along top surface 10606.Opposing ends of first and second windings 10614, 10616 form respectivefirst and second solder tabs 10618, 10620 disposed at opposite sides10622, 10624 of first magnetic element 10602. First and second sides10622, 10624 of first magnetic element 10602 are substantiallyperpendicular to first magnetic element top and bottom surfaces 10606,10608, and are separated by a linear separation distance 10626. Each offirst and second solder tabs 10618, 10620 extend away from firstmagnetic element 10602 in the lengthwise 10626 direction.

Coupled inductor 10600 additionally includes a ground return conductor10628 disposed on second magnetic element top surface 10610. Opposingends of ground return conductor 10628 respectively form first and secondground return solder tabs 10630. Second magnetic element 10604 typicallyextends over some or all of first and second solder tabs 10618, 10620and first and second ground return solder tabs 10630, thereby promotingsolder tab planarity and mechanical robustness. First and second soldertabs 10618, 10620 and first and second ground return solder tabs 10630are each offset by a common distance 10634 from first magnetic elementbottom surface 10608. In other words, each solder tab 10618, 10620,10630 is disposed in a common plane between first magnetic elementbottom surface 10608 and second magnetic element top surface 10610 tofacilitate use of inductor 10600 as a drop-in inductor in a PCBaperture.

FIG. 108 shows a top plan view of first magnetic element 10602. Incontrast with coupled inductor 9500 of FIG. 95, portions 10802, 10804between windings 10614, 10616 provide a path for magnetic flux linkingwindings 10614, 10616. Portions 10806, 10808 outside of the windings, onthe other hand, provide a path for leakage magnetic flux. Accordingly,leakage inductance associated with first and second windings 10614,10616 can be adjusted during inductor design and/or manufacture byvarying the size and/or configuration of outer portions 10806, 10808.For example, leakage inductance could be adjusted by varying thecross-sectional areas of outer portions 10806, 10808. As anotherexample, leakage inductance could be adjusted by adjusting the magneticpermeability of magnetic material forming outer portions 10806, 10808.Additionally, one or more of outer portions 10806, 10808 could include agap filled with non-magnetic material, such as air, plastic, adhesive,or paper, and leakage inductance could be adjusted by varying gapthickness.

Inductor 10600's configuration promotes placement of switching deviceson a common side of coupled inductor 10600. For example, FIG. 109 showsa PCB footprint 10900, which is one possible footprint for use withinductor 10600 in a two-phase buck converter application, such as in aconverter having a schematic similar to that of FIG. 2. Inductor 10600installs in an aperture 10902 of a PCB 10904. First and second soldertabs 10618, 10620 respectively couple to PCB pads 10906, 10908, andfirst and second ground return solder tabs 10630 respectively couple toPCB pads 10910. Not shown in FIG. 109 are buck converter switchingdevices electrically coupled to switching nodes Vx and a loadelectrically coupled to output node Vo. As shown by arrows IL1 and IL2,windings 10616, 10614 provide a path for current from an electricalpower source, which is modulated by the buck converter switchingdevices, to a load. Thus, the two switching stages will typically bedisposed on the same side of inductor 10600 to be near their respectiveVx terminals. Ground returns conductor 10628 provides a path for returncurrent from the load back to the electric power source, as shown byarrows Ignd. Inductor 10600 is not limited to use with footprint 10900or in multi-phase buck converter applications. For example, inductor10600 could be used in other topologies such as boost converters andbuck-boost converters.

FIG. 110 shows a perspective view of another drop-in coupled inductor11000, which is similar to coupled inductor 5000 (FIG. 50), but includesa magnetic core 11010 in place of magnetic core 5010. Magnetic core11010 includes first and second magnetic elements 11016, 11018, wheresecond magnetic element 11018 extends over at least some of solder tabs11012, thereby promoting solder tab planarity and strong mechanicalcoupling to a PCB in drop-in applications. FIG. 111 shows a perspectiveview of coupled inductor 11000 with first and second magnetic elements11016, 11018 separated from each other. FIG. 112 also shows aperspective view of the coupled inductor with first and second magneticelements 11016, 11018 separated from each other, but with the magneticelements shown as transparent. Second magnetic element 11018 is disposedon first magnetic element 11016 such that a bottom surface 11024 ofsecond magnetic element 11018 faces a top surface 11020 of firstmagnetic element 11016.

Coupled inductor 11000 further includes ground return conductors 11002,11004 and windings 11006, 11008. Ground return conductors 11002, 11004are disposed on a bottom surface 11014 of first magnetic element 11016and form respective solder tabs 11012 at their ends. Windings 11006,11008 are disposed on top surface 11020 of first magnetic element 11016and form respective solder tabs 11012 at their ends. In certainembodiments, all solder tabs 11012 are formed at the same heightrelative to first magnetic element bottom surface 11014. In other words,in such embodiments, each solder tab 11012 is disposed in a common planebetween first magnetic element bottom surface 11014 and second magneticelement top surface 11022 to facilitate use of inductor 11000 as adrop-in inductor in a PCB aperture. Neither first nor second magneticelement 11016 or 11018 forms a magnetic path loop around ground returnconductors 11002, 11004. Accordingly, inductance of ground returnconductors 11002, 11004 is not significantly increased by presence offirst and second magnetic elements 11016, 11018, while inductance ofwindings 11006, 11008 is increased by presence of first and secondmagnetic elements 11016, 11018, relative to an otherwise identicalinductor without the magnetic elements.

FIG. 113 shows a perspective view of a drop-in coupled inductor 11300,which is similar to inductor 11000 (FIG. 110), but with a differentground return conductor configuration. In particular, inductor 11300includes a ground return conductor 11302 disposed on first magneticelement bottom surface 11014, as well as a ground return conductor 11304disposed on second magnetic element top surface 11022. FIG. 114 shows aperspective view of coupled inductor 11000 with first and secondmagnetic elements 11016, 11018 separated from each other. FIG. 115 alsoshows a perspective view of the coupled inductor with first and secondmagnetic elements 11016, 11018 separated from each other, but with themagnetic elements shown as transparent.

Opposing first and second ends of ground return conductors 11302, 11304form respective ground return solder tabs 11312. In certain embodiments,each solder tab 11012 and 11312 is formed at a same height relative tofirst magnetic element bottom surface 11014. In other words, in suchembodiments, each solder tab 11012, 11312 is disposed in a common planebetween first magnetic element bottom surface 11014 and second magneticelement top surface 11022 to facilitate use of inductor 11300 as adrop-in inductor in a PCB aperture.

Neither first nor second magnetic element 11016, 11018 forms a magneticpath loop around ground return conductor 11302 or 11304. Accordingly,inductance of ground return conductors 11302, 11304 is not significantlyincreased by presence of first and second magnetic elements 11016,11018, while inductance of windings 11006, 11008 is increased bypresence of first and second magnetic elements 11016, 11018, relative toan otherwise identical inductor without the magnetic elements. Althoughit is anticipated that ground return conductors 11302, 11304 willtypically carry return current from a load back to an electric powersource, ground return conductors 11302, 11304 could be used for anotherpurpose, such as to electrically couple a load to an auxiliary electricpower source. Ground return conductor 11304 substantially covers secondmagnetic element top surface 11022, and ground return conductor 11302substantially covers first magnetic element bottom surface 11014,thereby acting as a shield and helping cool inductor 11300 and otherdevices in its vicinity.

FIG. 116 shows a perspective view of a drop-in coupled inductor 11600,which is similar to coupled inductor 11300 (FIG. 113), but includes asecond magnetic element 11618 that does not overlap the inductor'ssolder tabs. Thus, the second magnetic element of inductor 11600 will besmaller than that of inductor 11300, assuming all else is equal, therebypromoting material conservation and low cost. Second magnetic element11618 is disposed on first magnetic element 11016 such that a bottomsurface 11624 of second magnetic element 11618 faces a top surface 11020of first magnetic element 11016. Second ground return conductor 11304 isreplaced with second ground return conductor 11604, which forms groundreturn solder tabs 11612 at its opposing first and second ends. Incertain embodiments, each solder tab 11012 and 11612 is formed at a sameheight relative to first magnetic element bottom surface 11014. In otherwords, in such embodiments, each solder tab 11012, 11612 is disposed ina common plane between first magnetic element bottom surface 11014 andsecond magnetic element top surface 11622 to facilitate use of inductor11600 as a drop-in inductor in a PCB aperture.

Neither first nor second magnetic element 11016, 11618 forms a magneticpath loop around ground return conductor 11302 or 11604. Accordingly,inductance of ground return conductors 11302, 11604 is not significantlyincreased by presence of first and second magnetic elements 11016,11618, while inductance of windings 11006, 11008 is increased bypresence of first and second magnetic elements 11016, 11618, relative toan otherwise identical inductor without the magnetic elements. Althoughit is anticipated that ground return conductors 11302, 11604 willtypically carry return current from a load back to an electric powersource, ground return conductors 11302, 11604 could be used for anotherpurpose, such as to electrically couple a load to an auxiliary electricpower source. Ground return conductor 11604 substantially covers secondmagnetic element top surface 11622, and ground return conductor 11302substantially covers first magnetic element bottom surface 11014,thereby acting as a shield and helping cool inductor 11600 and othercomponents in its vicinity. FIG. 117 shows a perspective view of coupledinductor 11600 with first and second magnetic elements 11016, 11618separated from each other. FIG. 118 also shows a perspective view of thecoupled inductor with first and second magnetic elements 11016, 11618separated from each other, but with the magnetic elements shown astransparent.

FIG. 119 shows a perspective view of a coupled inductor 11900, which issimilar to coupled inductor 11600 (FIG. 16), but including two groundreturns conductors 11902, 11904 each disposed on first magnetic elementbottom surface 11014. Opposing ends of ground return conductors 11902,11904 form respective solder tabs 11912. In certain embodiments, eachsolder tab 11012 and 11912 is formed at a same height relative to firstmagnetic element bottom surface 11014. In other words, in suchembodiments, each solder tab 11012, 11912 is disposed in a common planebetween first magnetic element bottom surface 11014 and second magneticelement top surface 11622 to facilitate use of inductor 11900 as adrop-in inductor in a PCB aperture.

Neither first nor second magnetic element 11016, 11618 forms a magneticpath loop around ground return conductor 11902 or 11904. Accordingly,inductance of ground return conductors 11902, 11904 is not significantlyincreased by presence of first and second magnetic elements 11016,11618, while inductance of windings 11006, 11008 is increased bypresence of first and second magnetic elements 11016, 11618, relative toan otherwise identical inductor without the magnetic elements. Althoughit is anticipated that ground return conductors 11902, 11904 willtypically carry return current from a load back to an electric powersource, ground return conductors 11902, 11904 could be used for anotherpurpose, such as to electrically couple a load to an auxiliary electricpower source. FIG. 120 shows a perspective view of coupled inductor11900 with first and second magnetic elements 11016, 11618 separatedfrom each other. FIG. 121 also shows a perspective view of the coupledinductor with first and second magnetic elements 11016, 11618 separatedfrom each other, but with the magnetic elements shown as transparent.

It is anticipated that the foil windings and ground return conductorsdescribed herein are considerably thicker, and thereby offerconsiderably lower sheet resistivity, than the one-ounce copper foilused on many printed circuit boards. It is further anticipated that thefoil windings and ground return conductors described herein are madefrom a highly conductive material comprising primarily copper. Inalternative embodiments, the foil windings and ground return conductorsare made from a non-cuprous metal such as aluminum or steel having asolderable low resistance coating of copper, and in may in turn beplated with tin or an alloy comprising tin for enhanced solderability.

Combinations of Features

Features described above as well as those claimed below may be combinedin various ways without departing from the scope hereof. The followingexamples illustrate some possible combinations:

(A1) A coupled inductor may include (i) a core formed of magneticmaterial and having opposing top and bottom surfaces, (ii) a firstwinding wound through the core and including portions alternatelydisposed on the bottom and top surfaces of the core, (iii) a secondwinding wound through the core and including portions alternatelydisposed on the bottom and top surfaces of the core in a manner oppositeto that of the first winding, (iv) a leakage plate formed of magneticmaterial and having opposing top and bottom surfaces, the leakage platedisposed on the core such that the bottom surface of the leakage platefaces the top surface of the core, and (v) a first ground returnconductor disposed on a surface selected from the group consisting ofthe bottom surface of the core and the top surface of the leakage plate.

(A2) In the coupled inductor denoted as (A1), opposing first and secondends of the first winding may respectively form first and second soldertabs disposed in a common plane between the bottom surface of themagnetic core and the top surface of the leakage plate, opposing firstand second ends of the second winding may respectively form first andsecond solder tabs disposed in the common plane, and the first groundreturn conductor may form at least two ground return solder tabsdisposed in the common plane.

(A3) In the coupled inductor denoted as (A2), the core may includeopposing first and second sides each generally perpendicular to the topand bottom surfaces of the core, a linear separation distance betweenthe first and second sides of the core may define a length of the core,each first solder tab may be disposed at the first side of the core andextend away from the core in the lengthwise direction, and each secondsolder tab may be disposed at the second side of the core and extendaway from the core in the lengthwise direction.

(A4) In either of the coupled inductors denoted as (A2) or (A3), thefirst, second, and/or ground return solder tabs may extend along thebottom surface of the leakage plate.

(A5) In any of the coupled inductors denoted as (A1) through (A4), thefirst winding may have first and second portions disposed on the bottomand top surfaces of the core, respectively, the second winding may havethird and fourth portions disposed on the bottom and top surfaces of thecore, respectively, the first and fourth portions may be immediatelyadjacent to one another in the lengthwise direction, and the second andthird portions may be immediately adjacent to one another in thelengthwise direction.

(A6) In any of the coupled inductors denoted as (A1) through (A5),portions of the first and second windings may separate the core and theleakage plate.

(A7) Any of the coupled inductors denoted as (A1) through (A6) mayfurther include a non-magnetic spacer disposed between the core and theleakage plate.

(A8) In any of the coupled inductors denoted as (A1) through (A7), anair gap may separate the core and the leakage plate.

(A9) In any of the coupled inductors denoted as (A1) through (A8), theinductor may be configured such that inductance of the first groundreturn conductor is not significantly increased by presence of the coreand the leakage plate, while inductance of the first and second windingsis significantly increased by presence of the core and the leakageplate, relative to an otherwise identical inductor without the core andthe leakage plate.

(A10) Any of the coupled inductors denoted as (A1) through (A9) mayfurther include a second ground return conductor disposed on a surfaceselected from the group consisting of the bottom surface of the core andthe top surface of the leakage plate.

(A11) In any of the coupled inductors denoted as (A1) through (A10), thefirst ground return conductor may cover substantially all of a surfaceselected from the group consisting of the bottom surface of the core andthe top surface of the leakage plate.

((A12)) In any of the coupled inductors denoted as (A1) through (A11),current of increasing magnitude flowing into the first winding from thefirst side of the core may induce current of increasing magnitudeflowing into the second winding from the first side of the core.

(B1) A coupled inductor may include (i) a magnetic core including firstand second magnetic elements each having opposing top and bottomsurfaces, the second magnetic element disposed on the first magneticelement such that the bottom surface of the second magnetic elementfaces the top surface of the first magnetic element, (ii) a firstwinding disposed on the top surface of the first magnetic element, (iii)a second winding disposed on the top surface of the first magneticelement, and (iv) a first ground return conductor disposed on a surfaceselected from the group consisting of the bottom surface of the firstmagnetic element and the top surface of the second magnetic element.

(B2) In the coupled inductor denoted as (B1), the second winding maycross the first winding along the top surface of the first magneticelement.

(B3) The coupled inductor denoted as (B2) may further includeelectrically insulating material disposed between the first and secondwindings where the windings cross along the top surface of the firstmagnetic element.

(B4) In any of the coupled inductors denoted as (B1) through (B3),opposing first and second ends of the first winding may respectivelyform first and second solder tabs disposed in a common plane between thebottom surface of the first magnetic element and the top surface of thesecond magnetic element, opposing first and second ends of the secondwinding may respectively form first and second solder tabs disposed inthe common plane, and the first ground return conductor may form atleast two ground return solder tabs disposed in the common plane.

(B5) In the coupled inductor denoted as (B4), the core may includeopposing first and second sides each generally perpendicular to the topand bottom surfaces of the core, a linear separation distance betweenthe first and second sides of the core may define a length of the core,each first solder tab may be disposed at the first side of the core andextend away from the core in the lengthwise direction, and each secondsolder tab may be disposed at the second side of the core and extendaway from the core in the lengthwise direction.

(B6) In either of the coupled inductors denoted as (B4) or (B5), thefirst, second, and/or ground return solder tabs may extend along thebottom surface of the second magnetic element.

(B7) In any of the coupled inductors denoted as (B1) through (B6), thefirst ground return conductor may cover substantially all of the topsurface of the second magnetic element.

(B8) In any of the coupled inductors denoted as (B1) through (B7), theinductor may be configured such that inductance of the first groundreturn conductor is not significantly increased by presence of themagnetic core, while inductance of the first and second windings issignificantly increased by presence of the magnetic core, relative to anotherwise identical inductor without the magnetic core.

(B9) Any of the coupled inductors denoted as (B1) through (B8) mayfurther include a second ground return conductor disposed on a surfaceselected from the group consisting of the bottom surface of the firstmagnetic element and the top surface of the second magnetic element.

(B10) In the coupled inductor denoted as (B9), the first ground returnconductor may be disposed on the bottom surface of the first magneticelement, and the second ground return conductor may be disposed on thetop surface of the second magnetic element.

(C1) A coupled inductor may include (i) a core formed of magneticmaterial and including opposing top and bottom surfaces, (ii) a leakageplate formed of magnetic material and having opposing top and bottomsurfaces, the leakage plate disposed on the core such that the bottomsurface of the leakage plate faces the top surface of the core, (iii) Nwindings, N being an integer greater than one, each of the N windingswound through the core and having opposing first and second endsrespectively forming first and second solder tabs, each first and secondsolder tab disposed in a common plane between the bottom surface of thecore and the top surface of the leakage plate, and (iv) a first groundreturn conductor disposed on a surface selected from the groupconsisting of the bottom surface of the core and the top surface of theleakage plate, the first ground return conductor forming at least twoground return solder tabs disposed in the common plane.

(C2) In the coupled inductor denoted as (C1), the core may includeopposing first and second sides each generally perpendicular to the topand bottom surfaces of the core, a linear separation distance betweenthe first and second sides of the core may define a length of the core,each first solder tab may be disposed at the first side of the core andextend away from the core in the lengthwise direction, and each secondsolder tab may be disposed at the second side of the core and extendaway from the core in the lengthwise direction.

(C3) In either of the coupled inductors denoted as (C1) or (C2), each ofthe N windings may be wound around a respective winding axis, and eachwinding axis may (i) extend through the core, (ii) be offset from eachother winding axis, and (iii) be substantially parallel to each otherwinding axis.

(C4) In any of the coupled inductors denoted as (C1) through (C3), eachof the first, second, and/or ground return solder tabs may extend alongthe bottom surface of the leakage plate.

(C5) In any of the coupled inductors denoted as (C1) through (C4), theground return conductor may cover substantially all of the top surfaceof the leakage plate.

(C6) In any of the coupled inductors denoted as (C1) through (C5), theinductor may be configured such that inductance of the first groundreturn conductor is not significantly increased by presence of the coreand the leakage plate, while inductance of the first and second windingsis significantly increased by presence of the core and the leakageplate, relative to an otherwise identical inductor without the magneticcore.

(D1) A printed circuit assembly may include a printed circuit board andany one of the inductors denoted as (A1) through ((A12)), (B1) through(B10), or (C1) through (C6) disposed in an aperture in the printedcircuit board.

(E1) A printed circuit assembly may include a printed circuit board anda coupled inductor disposed in an aperture in the printed circuit board.The coupled inductor may include (i) a core formed of magnetic materialand including opposing top and bottom surfaces, (ii) a leakage plateformed of magnetic material and having opposing top and bottom surfaces,the leakage plate disposed on the core such that the bottom surface ofthe leakage plate faces the top surface of the core, (iii) N windings, Nbeing an integer greater than one, each of the N windings wound throughthe core and having opposing first and second ends respectively formingfirst and second solder tabs, each first and second solder tab disposedin a common plane between the bottom surface of the magnetic core andthe top surface of the leakage plate, and each of the first and secondsolder tabs soldered to a respective pad of the printed circuit board,and (iv) a first ground return conductor disposed on a surface selectedfrom the group consisting of the bottom surface of the core and the topsurface of the leakage plate, the first ground return conductor formingat least two ground return solder tabs disposed in the common plane andsoldered to respective pads of the printed circuit board.

(E2) The printed circuit assembly denoted as (E1) may further include Nswitching devices disposed on the printed circuit board, each of the Nswitching devices electrically coupled to a first end of a respectiveone of the N windings.

(E3) In either of the printed circuit assemblies denoted as (E1) or(E2), the N windings and the first ground return conductor maycollectively form part of a circuit delivering electric power from anelectric power source to a load, the N windings may carry current fromthe electric power source to the load, and the first ground returnconductor may carry return current from the load to the electric powersource.

(E4) In any of the printed circuit assemblies denoted as (E1) through(E3), the leakage plate may extend over the printed circuit board.

(E5) In any of the printed circuit assemblies denoted as (E1) through(E4), the core may include opposing first and second sides eachgenerally perpendicular to the top and bottom surfaces of the core, alinear separation distance between the first and second sides of thecore may define a length of the core, each first solder tab may bedisposed at the first side of the core and extend away from the core inthe lengthwise direction, and each second solder tab may be disposed atthe second side of the core and extend away from the core in thelengthwise direction.

(E6) In any of the printed circuit assemblies denoted as (E1) through(E5), each of the N windings may be wound around a respective windingaxis, and each winding axis may (i) extend through the core, (ii) beoffset from each other winding axis, and (iii) be substantially parallelto each other winding axis.

(E7) In any of the any of the printed circuit assemblies denoted as (E1)through (E6), each of the first, second, and/or ground return soldertabs may extend along the bottom surface of the leakage plate.

(E8) In any of the any of the printed circuit assemblies denoted as (E1)through (E7), the ground return conductor may cover substantially all ofthe top surface of the leakage plate.

(E9) In any of the printed circuit assemblies denoted as (E1) through(E8), the inductor may be configured such that inductance of the firstground return conductor is not significantly increased by presence ofthe core and the leakage plate, while inductance of the first and secondwindings is significantly increased by presence of the core and theleakage plate, relative to an otherwise identical inductor without themagnetic core.

(F1) A printed circuit assembly may include a printed circuit board anda coupled inductor disposed in an aperture in the printed circuit board.The coupled inductor may include (i) a first magnetic element havingopposing top and bottom surfaces, (ii) a second magnetic element havingopposing top and bottom surfaces, the second magnetic element disposedon the first magnetic element such that the bottom surface of the secondmagnetic element faces the top surface of the first magnetic element,(iii) a first winding disposed on the top surface of the first magneticelement, opposing first and second ends of the first winding formingrespective first and second solder tabs soldered to the printed circuitboard and disposed in a common plane between the bottom surface of thefirst magnetic element and the top surface of the second magneticelement, (iv) a second winding disposed on the top surface of the firstmagnetic element, opposing first and second ends of the second windingforming respective first and second solder tabs disposed in the commonplane and soldered to the printed circuit board, and (v) a first groundreturn conductor disposed on a surface selected from the groupconsisting of the bottom surface of the first magnetic element and thetop surface of the second magnetic element, the first ground returnconductor forming at least two ground return solder tabs disposed in thecommon plane and soldered to the printed circuit board.

(F2) The printed circuit assembly denoted as (F1) may further includefirst and second switching devices disposed on the printed circuitboard, where the first and second switching devices are electricallycoupled to the first and second windings, respectively.

(F3) In either of the printed circuit assemblies denoted as (F1) or(F2), the first and second windings and the first ground returnconductor may collectively form part of a circuit delivering electricpower from an electric power source to a load, the first and secondwindings may carry current from the electric power source to the load,and the first ground return conductor may carry return current from theload to the electric power source.

(F4) In any of the printed circuit assemblies denoted as (F1) through(F3), the second magnetic element may extend over the printed circuitboard.

(F5) In any of the printed circuit assemblies denoted as (F1) through(F4), the core may include opposing first and second sides eachgenerally perpendicular to the top and bottom surfaces of the core, alinear separation distance between the first and second sides of thecore may define a length of the core, each first solder tab may bedisposed at the first side of the core and extend away from the core inthe lengthwise direction, and each second solder tab may be disposed atthe second side of the core and extend away from the core in thelengthwise direction.

(F6) In any of the printed circuit assemblies denoted as (F1) through(F5), the first, second, and/or ground return solder tabs may extendalong the bottom surface of the second magnetic element.

(F7) In any of the any of the printed circuit assemblies denoted as (F1)through (F6), the ground return conductor may cover substantially all ofthe top surface of the second magnetic element.

(F8) In any of the any of the printed circuit assemblies denoted as (F1)through (F7), the inductor may be configured such that inductance of theground return conductor is not significantly increased by presence ofthe magnetic core, while inductance of the first and second windings issignificantly increased by presence of the magnetic core, relative to anotherwise identical inductor without the magnetic core.

(F9) In any of the printed circuit assemblies denoted as (F1) through(F8), the second winding may cross the first winding along the topsurface of the first magnetic element.

(F10) The printed circuit assemblies denoted as (F9) may further includeelectrically insulating material disposed between the first and secondwindings where the windings cross along the top surface of the firstmagnetic element.

Changes may be made in the above methods and systems without departingfrom the scope hereof. It should thus be noted that the matter containedin the above description or shown in the accompanying drawings should beinterpreted as illustrative and not in a limiting sense. The followingclaims are intended to cover all generic and specific features describedherein, as well as all statements of the scope of the present method andsystem, which, as a matter of language, might be said to falltherebetween.

What is claimed is:
 1. A printed circuit assembly, comprising: a printedcircuit board; and a coupled inductor disposed in an aperture in theprinted circuit board, the coupled inductor including: a core formed ofmagnetic material and including opposing top and bottom surfaces, aleakage plate formed of magnetic material and having opposing top andbottom surfaces, the leakage plate disposed on the core such that thebottom surface of the leakage plate faces the top surface of the core, Nwindings, N being an integer greater than one, each of the N windingswound through the core and having opposing first and second endsrespectively forming first and second solder tabs, each first and secondsolder tab disposed in a common plane between the bottom surface of themagnetic core and the top surface of the leakage plate, and each of thefirst and second solder tabs soldered to a respective pad of the printedcircuit board, and a first ground return conductor disposed on a surfaceselected from the group consisting of the bottom surface of the core andthe top surface of the leakage plate, the first ground return conductorforming at least two ground return solder tabs disposed in the commonplane and soldered to respective pads of the printed circuit board. 2.The printed circuit assembly of claim 1, further comprising N switchingdevices disposed on the printed circuit board, each of the N switchingdevices electrically coupled to a first end of a respective one of the Nwindings.
 3. The printed circuit assembly of claim 1, wherein: the Nwindings and the first ground return conductor collectively form part ofa circuit delivering electric power from an electric power source to aload; the N windings carry current from the electric power source to theload; and the first ground return conductor carries return current fromthe load to the electric power source.
 4. The printed circuit assemblyof claim 1, wherein the leakage plate extends over the printed circuitboard.
 5. A printed circuit assembly, comprising: a printed circuitboard; and a coupled inductor disposed in an aperture in the printedcircuit board, the coupled inductor including: a first magnetic elementhaving opposing top and bottom surfaces, a second magnetic elementhaving opposing top and bottom surfaces, the second magnetic elementdisposed on the first magnetic element such that the bottom surface ofthe second magnetic element faces the top surface of the first magneticelement, a first winding disposed on the top surface of the firstmagnetic element, opposing first and second ends of the first windingforming respective first and second solder tabs soldered to the printedcircuit board and disposed in a common plane between the bottom surfaceof the first magnetic element and the top surface of the second magneticelement, a second winding disposed on the top surface of the firstmagnetic element, opposing first and second ends of the second windingforming respective first and second solder tabs disposed in the commonplane and soldered to the printed circuit board, and a first groundreturn conductor disposed on a surface selected from the groupconsisting of the bottom surface of the first magnetic element and thetop surface of the second magnetic element, the first ground returnconductor forming at least two ground return solder tabs disposed in thecommon plane and soldered to the printed circuit board.
 6. The printedcircuit assembly of claim 5, further comprising first and secondswitching devices disposed on the printed circuit board, the first andsecond switching devices electrically coupled to the first and secondwindings, respectively.
 7. The printed circuit assembly of claim 5,wherein: the first and second windings and the first ground returnconductor collectively form part of a circuit delivering electric powerfrom an electric power source to a load; the first and second windingscarry current from the electric power source to the load; and the firstground return conductor carries return current from the load to theelectric power source.
 8. The printed circuit assembly of claim 5,wherein the second magnetic element extends over the printed circuitboard.
 9. The printed circuit assembly of claim 5, the second windingcrossing the first winding along the top surface of the first magneticelement.